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Thermal Design Guide for Socket F 1207 Processors
Models:
1207
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Backplate Assembly
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Thermal Design Guide for Socket F (1207) Processors
Publication #
32800
Revision:
3.00
Issue Date:
August 2006
Advanced Micro Devices
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Contents
Thermal Design Guide for Socket F 1207 Processors
Advanced Micro Devices, Inc. All rights reserved
Contents
Heat Sink Fans Thermal Interface Material
List of Figures
List of Figures
List of Figures
List of Tables
List of Tables
List of Tables
Revision History
Revision History
Revision History
Chapter Introduction
Summary of Requirements
Chapter
Chapter Processor Thermal Solutions
Processor Specifications
1207-Pin Socket
Socket Description
Motherboard Component Height Restrictions
Sample Heat Sinks and Attachment Methods
Thermal Solution Design Requirements
Part Description Material Quantity
Backplate Assembly
Retention Frame
Thermal Design of Platforms Using the AMD Processor-In-a
Chapter Thermal Design of Custom 1U-2P Systems
Thermal Design of Custom 1U-2P Systems
Symbol
Systems
Spring Screws
Exploded View of Thermal Solution for Custom 1U-2P Systems
Fin Parameters
Heat Sink
Fans
Thermal Interface Material
Thermal Design of Custom 1U-2P Systems
Chapter Thermal Design of Custom 2U-4P Systems
Thermal Design of Custom 2U-4P Systems
Thermal Solution Design Requirements
Heat sink Aluminum Fan Plastic Spring clip
Backplate Assembly
Chemical Element of SK7 Spring Steel
Spring Clip
High Performance Heat Sink for Custom 2U-4P Systems
Fans
Thermal Design of Custom 2U-4P Systems
Appendix a
Solution for Socket F 1207 Processors
Socket F 1207 PIB Board Component Height Restrictions
64.36 76.41 49.91 59.81
787
724 000 784 520 189
Socket F 1207 PIB Socket Outline and Socket Window
Zone
1207 PIB Heat Sink Height
2x11.44 2x51.26 2x61.08
36.59 32.13 27.59
Keep-Out
1207 PIB
318 000 885
233
Thermal
10.09 33.91 49.91
Solution for Socket F 1207 Processors
Socket F 1207 Processor
Appendix B
1207
Drawings for
2P Systems Processor
Height Restrictions
Holes, Contact Pads,
Based
No-Routing Zone
32.16 71.98 24.54 10.09 49.91 64.36
Based on
Processor
Window
Height Restriction Zone
1U-2P Systems 1207 Processor
42.71 82.53 32.16 71.98
2P Board No-Through-Hole Keep
Keep-Out
Out
598 000 166 40.59 80.41
233 335 965
1207 1U
35.04
22.04 10.09 33.9 49.91 61.86
Socket F 1207 Processor
Appendix C
Socket F 1207 2U-4P Board Component Height Restrictions
47.40 87.22 35.65
4P Mounting Holes, Contact Pads, and No-Routing Zone
24.54 64.36
75.47
1207 2U-4P Socket Outline
Custom 2U-4P
Socket Window
17.59
2U-4P Systems 1207 Processor
260
681 266
40.59 80.41
Socket F 1207 2U-4P Board No-Through-Hole Keep-Out
166 80.41
1207
Socket F 1207 Processor
Socket F 1207 Processors
Appendix D
Streamline Plot of AMD Reference Custom 2U-4P System
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