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AMD Appendix C, Drawings for, F 1207 Processor, Based on the, Keep-Out, SocketF, Z o n e

Models: 1207

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Figure29.

Appendix C

	Keep-Out
Socket	Drawings for
F (1207) Processor	Custom 2U-4P Systems
	Based on the

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Figure29.	B a c k p la t e	C o n t a c t		Z o n e		V ie w				6			5			4		3	2	1
	8					7				6			5			4		3	2	1
SocketF	D																			D
(1207)											N o n - p l a t e d t h r u h o l e					8 . 8 0 0 . 3 4 6
2U		1 2 . 6 3 0 . 4 9 7														7 . 0 8 0 . 2 7 9		2 x
2U		3 . 1 3 0 . 1 2 3			2 x							P in A 1				0 . 9 2 0 . 0 3 6		2 x
-4P		0 . 0 0		0 . 0 0 0												4 . 3 7	0 . 1 7 2
-4P		N o n - p l a t e d t h r u h o le														4 . 3 7	0 . 1 7 2
Backplate	C	1 8 . 3 7		0 . 7 2 3												1 4 . 3 7 0 . 5 6 6				C
		1 8 . 3 7		0 . 7 2 3												2 2 . 3 7	0 . 8 8 1
																2 2 . 3 7	0 . 8 8 1
		1 0 . 0 0	0 . 3 9 4													3 2 . 3 7	1 . 2 7 4
																3 2 . 3 7	1 . 2 7 4
		3 9 . 8 7 1 . 5 7 0			2 x											3 5 . 8 2 1 . 4 1 0		2 x
ContactZone		4 9 . 3 7		1 . 9 4 4		1.59840.59	2x01.3835.04	2x80.8622.04	2x70.3910.09	0.0000.00	2x30.235.91	2x51.3333.91	2x51.9649.91	2x52.4361.86	2.83471.98	4 3 . 8 2 1 . 7 2 5		2 x
ContactZone		4 9 . 3 7		1 . 9 4 4		1.59840.59	2x01.3835.04	2x80.8622.04	2x70.3910.09	0.0000.00	2x30.235.91	2x51.3333.91	2x51.9649.91	2x52.4361.86	2.83471.98	74.86
																2x
																3.166
																7
	B															2.94				B
																80.41

								A D V A N C E D M I C R O D E V I C E S
								A U S T IN , T E X A S
0 . 0 0 [ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e i g h t ; T i e t o g r o u n d .								T IT L E :
								S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t	A
A									A
0 . 0 0	[ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e ig h t ; N o o u t e r l a y e r t r a c e s .							K e e p o u t a n d H e i g h t R e s t r ic t i o n s ,
0 . 0 0								f o r C u s t o m 2 U / 4 P F o r m F a c t o r
								f o r C u s t o m 2 U / 4 P F o r m F a c t o r
0 . 0 0	[ 0 . 0 0 0 '' ] M a x c o m p o n e n t h e ig h t .							D W G . N O .	R E V
								D W G . N O .	R E V
3 . 3 0	[ 0 . 1 3 0 '' ] M a x c o m p o n e n t h e ig h t .							7 9 Z 0 0 0 0 1 2 9	3 . 1
								S H E E T 6 O F 6
	8	7	6	5	4	3	2	1

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

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AMD Appendix C, Drawings for, F 1207 Processor, Based on the, Keep-Out, Custom 2U-4P Systems, SocketF, Z o n e

Contents

Publication # Issue DateThermal Design Guide for Socket F 1207 Processors Advanced Micro DevicesTrademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 4 Thermal Design of Custom 1U-2P Systems ContentsChapter 2 Processor Thermal Solutions ContentsAppendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of Tables32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsList of Tables Revision Revision HistoryRevision History Date32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsRevision History Introduction Chapter 1 Introduction1.1 Summary of Requirements ChapterChapter IntroductionThermal Design Guide for Socket F 1207 Processors Processor Thermal Solutions Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Mechanical and Thermal Specifications for Socket F 1207 ProcessorsProcessor Thermal Solutions 2.2 Socket DescriptionFigure 1. The 1207-Pin Socket Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-aThermal Design of Platforms Using the AMD Processor-In-a 3.2 Thermal Solution Design Requirements3.3 Sample Heat Sinks and Attachment Methods Material Thermal Design of Platforms Using the AMD Processor-In-aChapter Part DescriptionThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate AssemblyChapter 3.3.2 Retention FrameThermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems 4.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.2 Spring ScrewsChapter 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Fin ParametersThermal Design of Custom 1U-2P Systems 4.3.4 FansThermal Design of Custom 1U-2P Systems 4.3.5 Thermal Interface MaterialChapter Chapter Thermal Design of Custom 1U-2P SystemsThermal Design Guide for Socket F 1207 Processors Chapter Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems 5.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 2U-4P SystemsChapter 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChemical Element of SK7 Spring Steel 5.3.2 Spring Clip5.3.3 Retention Frame 5.3.4 Heat SinkLength Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.3.5 Fans5.3.6 Thermal Interface Material ChapterChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsAppendix A A D V A N C E D M I C R O D E V I C E S Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A Thermal Design Guide for Socket F 1207 Processors0.787 Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A Thermal Design Guide for Socket F 1207 ProcessorsThermal Design Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Guide for Socket F 1207 ProcessorsAppendix A F 1207 PIBHeat Sink Height ZoneThermal Design Guide for Socket F 1207 Processors Keep-OutAppendix A F 1207 PIBThermal Design Guide Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Appendix AAppendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 ProcessorsKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor Appendix B Drawings for2P Systems Processor Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, and on theWindow F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket Based on theAppendix B Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Height Restriction ZoneDrawings for Keep-OutFigure 22. Socket F 1207 1U 2P Board No-Through-Hole KeepF 1207 Processor F 1207 1UAppendix B Drawings forAppendix B Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 1U-2P Systems Based on theKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CSocket F 1207 Processor Appendix C Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for F 1207 ProcessorF 1207 Processor 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C Keep-OutDrawings for Custom 2U-4PF 1207 2U-4P Socket Outline and Socket WindowDrawings for Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Appendix CAppendix C Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for F 1207 ProcessorF 1207 Processor 1207Appendix C Drawings forAppendix C Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 2U-4P Systems Based on theSocket F 1207 Processors Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemAppendix D Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System