32800 Rev. 3.02 3.00 August 2006 | Thermal Design Guide for Socket F (1207) Processors |
Lifting the heat sink away from the processor can result in damage to the processor contact pads, the socket contacts, or the socket
4.3.3Heat Sink
Figure 6 shows a picture of the reference design heat sink for
Figure 6. High Performance Heat Sink for Custom 1U-2P Systems
Table 6 shows the parameters of the aluminum fins for the
Table 6. | Fin Parameters |
|
|
|
| |
|
|
|
|
|
|
|
Length | Height (at | Height (at Edges) | Thickness | Pitch | No. of Fins |
|
Center) |
| |||||
|
|
|
|
|
| |
|
|
|
|
|
|
|
87 mm | 22 mm | 26.5 mm | 0.4 mm | 1.48 | 50 |
|
|
|
|
| mm |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Chapter 4 | Thermal Design of Custom | 25 |