32800 Rev. 3.02 August 2006 | Thermal Design Guide for Socket F (1207) Processors |
on flow simulations of an AMD reference 2U system, the
Figure 11. Thermal Performance Chart of Heat Sink When Used with a
5.3.5Fans
AMD has conducted simulations of the heat sink described in Section 5.3.4 on page 33 with two 60
mmx 60 mm x 38 mm fans (Delta Part number
5.3.6Thermal Interface Material
The heat sink makes contact with the top surface of the processor package utilizing the thermal interface material between the processor lid and the heat sink. AMD recommends using a high performance grease such as
Chapter 5 | Thermal Design of Custom | 35 |