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manual Thermal Design Guide for Socket F 1207 Processors, Revision History
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Specs
Issue Date
Backplate Assembly
Processor Thermal Solutions
Page 10
Image 10
Thermal Design Guide for Socket F (1207) Processors
32800 Rev. 3.02 August 2006
10
Revision History
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Contents
Advanced Micro Devices
Issue Date
Thermal Design Guide for Socket F 1207 Processors
Publication #
2005 Advanced Micro Devices, Inc. All rights reserved
Trademarks
Contents
Contents
Chapter 2 Processor Thermal Solutions
Chapter 4 Thermal Design of Custom 1U-2P Systems
Socket F 1207 Processor
Socket F 1207 Processors
Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the
Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the
List of Figures
List of Figures
Figure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System
List of Tables
List of Tables
List of Tables
Thermal Design Guide for Socket F 1207 Processors
32800 Rev. 3.02 August
Date
Revision History
Revision History
Revision
Revision History
Thermal Design Guide for Socket F 1207 Processors
32800 Rev. 3.02 August
Chapter
Chapter 1 Introduction
1.1 Summary of Requirements
Introduction
Thermal Design Guide for Socket F 1207 Processors
Introduction
Chapter
Mechanical and Thermal Specifications for Socket F 1207 Processors
Chapter 2 Processor Thermal Solutions
2.1 Processor Specifications
Processor Thermal Solutions
Figure 1. The 1207-Pin Socket
2.2 Socket Description
Processor Thermal Solutions
Thermal Design of Platforms Using the AMD Processor-In-a
Chapter 3 Thermal Design of Platforms Using
the AMD Processor-In-a-Box PIB Thermal Solution
Box PIB Thermal Solution
3.3 Sample Heat Sinks and Attachment Methods
3.2 Thermal Solution Design Requirements
Thermal Design of Platforms Using the AMD Processor-In-a
Part Description
Thermal Design of Platforms Using the AMD Processor-In-a
Chapter
Material
3.3.1 Backplate Assembly
Thermal Design of Platforms Using the AMD Processor-In-a
Thermal Design of Platforms Using the AMD Processor-In-a
3.3.2 Retention Frame
Chapter
Thermal Design Guide for Socket F 1207 Processors
Thermal Design of Platforms Using the AMD Processor-In-a
Box PIB Thermal Solution
Chapter
Thermal Design of Custom 1U-2P Systems
Chapter 4 Thermal Design of Custom 1U-2P Systems
4.1 Motherboard Component Height Restrictions
Chapter
4.3 Sample Heat Sinks and Attachment Methods
4.2 Thermal Solution Design Requirements
Thermal Solution Design Requirements for Custom 1U-2P Systems
Thermal Design of Custom 1U-2P Systems
Thermal Design of Custom 1U-2P Systems
Systems
Chapter
Quantity
4.3.2 Spring Screws
4.3.1 Backplate Assembly
Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems
Thermal Design of Custom 1U-2P Systems
Fin Parameters
4.3.3 Heat Sink
Figure 6. High Performance Heat Sink for Custom 1U-2P Systems
Chapter
4.3.4 Fans
Thermal Design of Custom 1U-2P Systems
Chapter
4.3.5 Thermal Interface Material
Thermal Design of Custom 1U-2P Systems
Thermal Design Guide for Socket F 1207 Processors
Thermal Design of Custom 1U-2P Systems
Chapter
Thermal Design of Custom 2U-4P Systems
Chapter 5 Thermal Design of Custom 2U-4P Systems
5.1 Motherboard Component Height Restrictions
Chapter
5.3 Sample Heat Sinks and Attachment Methods
5.2 Thermal Solution Design Requirements
Thermal Solution Design Requirements for Custom 2U-4P Systems
Thermal Design of Custom 2U-4P Systems
Thermal Design of Custom 2U-4P Systems
Systems
Chapter
Quantity
Thermal Design Guide for Socket F 1207 Processors
5.3.1 Backplate Assembly
Thermal Design of Custom 2U-4P Systems
Chapter
5.3.4 Heat Sink
5.3.2 Spring Clip
5.3.3 Retention Frame
Chemical Element of SK7 Spring Steel
Thermal Design of Custom 2U-4P Systems
Figure 10. High Performance Heat Sink for Custom 2U-4P Systems
Fin Parameters
Length
Chapter
5.3.5 Fans
5.3.6 Thermal Interface Material
Thermal Design of Custom 2U-4P Systems
Thermal Design Guide for Socket F 1207 Processors
Thermal Design of Custom 2U-4P Systems
Chapter
Appendix A
Solution for Socket F 1207 Processors
Keep-Out Drawings for Platforms Using the PIB Thermal
Thermal Design Guide for Socket F 1207 Processors
Figure 12. Socket F 1207 PIB Board Component Height Restrictions
Appendix A
A D V A N C E D M I C R O D E V I C E S
Thermal Design Guide for Socket F 1207 Processors
Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing Zone
Appendix A
0.787
Guide for Socket F 1207 Processors
Socket F 1207 PIB Socket Outline and Socket Window
Appendix A
Thermal Design
Zone
F 1207 PIB
Heat Sink Height
Appendix A
F 1207 PIB
Keep-Out
Appendix A
Thermal Design Guide for Socket F 1207 Processors
Appendix A
Figure 17. Socket F 1207 PIB Board Bottom Side Keep-Out
Thermal
Thermal Design Guide
Thermal Design Guide for Socket F 1207 Processors
Solution for Socket F 1207 Processors
Keep-Out Drawings for Platforms Using the PIB Thermal
Appendix A
Socket F 1207 Processor
Appendix B
Keep-Out Drawings for Custom 1U-2P Systems Based on the
Height Restrictions
Drawings for
2P Systems Processor
Appendix B
on the
Based
Holes, Contact Pads, and
No-Routing Zone
Based on the
F 1207 Processor
Figure 20. Socket F 1207 1U-2P Socket Outline and Socket
Window
Height Restriction Zone
Figure 21. Socket F 1207 1U-2P Heat Sink
1U-2P Systems 1207 Processor
Appendix B
2P Board No-Through-Hole Keep
Keep-Out
Figure 22. Socket F 1207 1U
Drawings for
Drawings for
F 1207 1U
Appendix B
F 1207 Processor
Keep-Out Drawings for Custom 1U-2P Systems Based on the
Socket F 1207 Processor
Thermal Design Guide for Socket F 1207 Processors
Appendix B
Socket F 1207 Processor
Appendix C
Keep-Out Drawings for Custom 2U-4P Systems Based on the
F 1207 Processor
Figure 24. Socket F 1207 2U-4P Board Component Height Restrictions
Drawings for
Appendix C
Keep-Out
4P Mounting Holes, Contact Pads, and No-Routing Zone
Appendix C
F 1207 Processor
Socket Window
Custom 2U-4P
F 1207 2U-4P Socket Outline and
Drawings for
Appendix C
Figure 27. Socket F 1207 2U-4P Heat Sink
2U-4P Systems 1207 Processor
Drawings for
F 1207 Processor
Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out
Drawings for
Appendix C
Drawings for
1207
Appendix C
F 1207 Processor
Keep-Out Drawings for Custom 2U-4P Systems Based on the
Socket F 1207 Processor
Thermal Design Guide for Socket F 1207 Processors
Appendix C
Appendix D
Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System
Socket F 1207 Processors
Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System
Socket F 1207 Processors