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AMD manual F 1207 1U, Appendix B, Drawings for, F 1207 Processor, Based on the, Zone, Keep-Out

Models: 1207

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F (1207) 1U

Appendix B

	Keep-Out
Socket	Drawings for
F (1207) Processor	Custom 1U-2P Systems
	Based on the

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Figure 23.		8				7					6			5						4			3
		8				7					6			5						4			3
Socket		B a c k p l a t e C o n t a c t Z o n e V i e w
Socket	D
F (1207) 1U	D
F (1207) 1U																N o n - p l a t e d			m	o u n t i n g	h o l e
-2P																		8 . 8 0		0 . 3 4 6
Backplate		1 4	. 6 3	0 . 5 7 6								P i n	A 1
Backplate	C	3 . 1 3	0 . 1 2 3		2 x							P i n	A 1								7 . 0 8	0 . 2 7 9	2 x
		3 . 1 3	0 . 1 2 3		2 x																7 . 0 8	0 . 2 7 9	2 x
		0 . 0 0		0 . 0 0 0																	0 . 9 2	0 . 0 3 6	2 x
				1 0 . 0 0		0 . 3 9 4															4 . 3 7	0 . 1 7 2
				1 0 . 0 0		0 . 3 9 4
		N o n - p l a t e d m o u n t i n g h o l e																			1 4 . 3 7	0 . 5 6 6
Contact																					2 2 . 3 7	0 . 8 8 1
Contact		1 8 . 3 7	0 . 7 2 3		2 x																3 2 . 3 7	1 . 2 7 4
		1 8 . 3 7	0 . 7 2 3		2 x																3 5 . 8 2	1 . 4 1 0	2 x
		3 9 . 8 7	1 . 5 7 0		2 x																3 5 . 8 2	1 . 4 1 0	2 x
		3 9 . 8 7	1 . 5 7 0		2 x
		5 1	. 3 7	2 . 0 2 2																	4 3 . 8 2	1 . 7 2 5	2 x
Zone	B	5 1	. 3 7	2 . 0 2 2
	B
							2x		2x	2x		2x	2x	2x	2x		2x
						1.598	1.38 0	1.266	0.86 8	0.39 7	0.000	0.233	1.335	1.965	2.43 5	2.834	2.94 7	3.166
						40.59	35.04	32.16	22.04	10.09	0.00	5.9 1	33.9 1	49.91	61.86	71.98	74.86	80.41

A	0 . 0 0	[ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t ; T i e t o g r o u n d .
	0 . 0 0	[ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t ; N o o u t e r l a y e r t r a c e s .
	0 . 0 0	[ 0 . 0 0 0 ' '] M a x c o m p o n e n t h e i g h t .
	3 . 3 0	[ 0 . 1 3 0 ' '] M a x c o m p o n e n t h e i g h t .
		8	7	6	5	4	3

2

2

1

D

C

B

A D V A N C E D M I C R O D E V I C E S

A U S T I N , T E X A S

T IT L E :
S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t	A
K e e p o u t a n d H e i g h t R e s t r i c t i o n s ,
f o r C u s t o m 1 U / 2 P F o r m F a c t o r
D W G . N O .	R E V
7 9 Z 0 0 0 0 1 2 8	3 . 1
S H E E T	6 O F 6
1

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Image 51

AMD F 1207 1U, Appendix B, Drawings for, F 1207 Processor, Based on the, Zone, Keep-Out, Socket, Custom 1U-2P Systems

Contents

Publication # Issue DateThermal Design Guide for Socket F 1207 Processors Advanced Micro DevicesTrademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 4 Thermal Design of Custom 1U-2P Systems ContentsChapter 2 Processor Thermal Solutions ContentsAppendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesThermal Design Guide for Socket F 1207 Processors List of Tables32800 Rev. 3.02 August Revision Revision HistoryRevision History DateThermal Design Guide for Socket F 1207 Processors Revision History32800 Rev. 3.02 August Introduction Chapter 1 Introduction1.1 Summary of Requirements ChapterIntroduction Thermal Design Guide for Socket F 1207 ProcessorsChapter Processor Thermal Solutions Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Mechanical and Thermal Specifications for Socket F 1207 Processors2.2 Socket Description Figure 1. The 1207-Pin SocketProcessor Thermal Solutions Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-a3.2 Thermal Solution Design Requirements 3.3 Sample Heat Sinks and Attachment MethodsThermal Design of Platforms Using the AMD Processor-In-a Material Thermal Design of Platforms Using the AMD Processor-In-aChapter Part DescriptionThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate Assembly3.3.2 Retention Frame Thermal Design of Platforms Using the AMD Processor-In-aChapter Chapter Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems 4.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.2 Spring ScrewsChapter 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Fin ParametersThermal Design of Custom 1U-2P Systems 4.3.4 Fans4.3.5 Thermal Interface Material ChapterThermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems 5.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 2U-4P SystemsChapter 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChemical Element of SK7 Spring Steel 5.3.2 Spring Clip5.3.3 Retention Frame 5.3.4 Heat SinkLength Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.3.5 Fans5.3.6 Thermal Interface Material ChapterThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChapter Solution for Socket F 1207 Processors Appendix AKeep-Out Drawings for Platforms Using the PIB Thermal A D V A N C E D M I C R O D E V I C E S Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A Thermal Design Guide for Socket F 1207 Processors0.787 Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A Thermal Design Guide for Socket F 1207 ProcessorsThermal Design Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Guide for Socket F 1207 ProcessorsAppendix A F 1207 PIBHeat Sink Height ZoneThermal Design Guide for Socket F 1207 Processors Keep-OutAppendix A F 1207 PIBThermal Design Guide Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Appendix AAppendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 ProcessorsAppendix B Socket F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix B Drawings for2P Systems Processor Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, and on theWindow F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket Based on theAppendix B Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Height Restriction ZoneDrawings for Keep-OutFigure 22. Socket F 1207 1U 2P Board No-Through-Hole KeepF 1207 Processor F 1207 1UAppendix B Drawings forAppendix B Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 1U-2P Systems Based on theAppendix C Socket F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix C Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for F 1207 ProcessorF 1207 Processor 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C Keep-OutDrawings for Custom 2U-4PF 1207 2U-4P Socket Outline and Socket WindowDrawings for Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Appendix CAppendix C Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for F 1207 ProcessorF 1207 Processor 1207Appendix C Drawings forAppendix C Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 2U-4P Systems Based on theFigure 30. Floor-Plan of AMD Reference Custom 2U-4P System Appendix DSocket F 1207 Processors Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System