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AMD 1207 manual Retention Frame, Chapter, Thermal Design of Platforms Using the AMD Processor-In-a

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3.3.2Retention Frame

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Note: Do not cut entirely through the center rib. Doing so will compromise the stiffness of the backplate.

The plate uses two PennEngineering (PEM) standoffs that serve multiple purposes. The PEM standoffs serve as attachment points for the retention frame screws. They also align the backplate properly to the motherboard. Features in the retention frame slide over the standoffs and allow the installation of the screws with a minimum chance of cross threading. Additionally, four M3.5 PEM standoffs in the backplate serve as attachment points for the socket.

The insulator prevents the backplate from electrically shorting to the motherboard. A pressure- sensitive adhesive in the insulator keeps the backplate in place against the motherboard during assembly. The insulator also is thick enough to prevent any significant capacitive coupling between the motherboard and backplate.

3.3.2Retention Frame

The plastic retention frame, made of 20% glass-filled Lexan, is a two-piece implementation rather than the single-piece frame used for socket 940. This change accommodates the larger foot-print of socket F (1207) processors.

The retention frame serves multiple purposes. The retention frame aligns the heat sink and provides a stop for the heat sink in large shock-force events. The retention frame and backplate are attached to the motherboard by the motherboard vendor. Two screws securely hold the backplate and retention frame together. The two mounting tabs on the retention frame serve as attachment points for the heat sink spring clip.

Chapter 3	Thermal Design of Platforms Using the AMD Processor-In-a-	19
	Box (PIB) Thermal Solution

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AMD 1207 manual Retention Frame, Chapter, Thermal Design of Platforms Using the AMD Processor-In-a

Contents

Publication # Issue DateThermal Design Guide for Socket F 1207 Processors Advanced Micro DevicesTrademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 4 Thermal Design of Custom 1U-2P Systems ContentsChapter 2 Processor Thermal Solutions ContentsAppendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesList of Tables Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Revision Revision HistoryRevision History DateRevision History Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Introduction Chapter 1 Introduction1.1 Summary of Requirements ChapterThermal Design Guide for Socket F 1207 Processors IntroductionChapter Processor Thermal Solutions Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Mechanical and Thermal Specifications for Socket F 1207 ProcessorsFigure 1. The 1207-Pin Socket 2.2 Socket DescriptionProcessor Thermal Solutions Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-a3.3 Sample Heat Sinks and Attachment Methods 3.2 Thermal Solution Design RequirementsThermal Design of Platforms Using the AMD Processor-In-a Material Thermal Design of Platforms Using the AMD Processor-In-aChapter Part DescriptionThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate AssemblyThermal Design of Platforms Using the AMD Processor-In-a 3.3.2 Retention FrameChapter Chapter Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems 4.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.2 Spring ScrewsChapter 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Fin ParametersThermal Design of Custom 1U-2P Systems 4.3.4 FansChapter 4.3.5 Thermal Interface MaterialThermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 1U-2P SystemsChapter Chapter Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems 5.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 2U-4P SystemsChapter 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChemical Element of SK7 Spring Steel 5.3.2 Spring Clip5.3.3 Retention Frame 5.3.4 Heat SinkLength Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.3.5 Fans5.3.6 Thermal Interface Material ChapterThermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 2U-4P SystemsChapter Appendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal A D V A N C E D M I C R O D E V I C E S Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A Thermal Design Guide for Socket F 1207 Processors0.787 Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A Thermal Design Guide for Socket F 1207 ProcessorsThermal Design Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Guide for Socket F 1207 ProcessorsAppendix A F 1207 PIBHeat Sink Height ZoneThermal Design Guide for Socket F 1207 Processors Keep-OutAppendix A F 1207 PIBThermal Design Guide Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Appendix AAppendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 ProcessorsSocket F 1207 Processor Appendix BKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix B Drawings for2P Systems Processor Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, and on theWindow F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket Based on theAppendix B Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Height Restriction ZoneDrawings for Keep-OutFigure 22. Socket F 1207 1U 2P Board No-Through-Hole KeepF 1207 Processor F 1207 1UAppendix B Drawings forAppendix B Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 1U-2P Systems Based on theSocket F 1207 Processor Appendix CKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix C Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for F 1207 ProcessorF 1207 Processor 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C Keep-OutDrawings for Custom 2U-4PF 1207 2U-4P Socket Outline and Socket WindowDrawings for Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Appendix CAppendix C Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for F 1207 ProcessorF 1207 Processor 1207Appendix C Drawings forAppendix C Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 2U-4P Systems Based on theAppendix D Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemSocket F 1207 Processors Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System