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AMD 1207 manual Thermal Interface Material, Chapter, Thermal Design of Custom 1U-2P Systems

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32800 Rev. 3.02 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

4.3.5Thermal Interface Material

The heat sink contacts the top surface of the processor package and utilizes the thermal interface material between the processor lid and the heat sink. AMD recommends using a high performance grease such as Shin-Etsu 7783D or Dow Corning TC-5022. AMD does not recommend using phase change materials between the heat sink and the processor. Phase-change materials develop high adhesion forces between the heat sink and processor when the material is in the solid phase. This strong adhesive force can cause the processor to stick to the heat sink, making heat sink removal difficult and damaging the socket solder balls.

Chapter 4

Thermal Design of Custom 1U-2P Systems

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AMD 1207 manual Thermal Interface Material, Chapter, Thermal Design of Custom 1U-2P Systems

Contents

Publication # Issue DateThermal Design Guide for Socket F 1207 Processors Advanced Micro DevicesTrademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 4 Thermal Design of Custom 1U-2P Systems ContentsChapter 2 Processor Thermal Solutions ContentsAppendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesThermal Design Guide for Socket F 1207 Processors List of Tables32800 Rev. 3.02 August Revision Revision HistoryRevision History DateThermal Design Guide for Socket F 1207 Processors Revision History32800 Rev. 3.02 August Introduction Chapter 1 Introduction1.1 Summary of Requirements ChapterIntroduction Thermal Design Guide for Socket F 1207 ProcessorsChapter Processor Thermal Solutions Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Mechanical and Thermal Specifications for Socket F 1207 Processors2.2 Socket Description Figure 1. The 1207-Pin SocketProcessor Thermal Solutions Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-a3.2 Thermal Solution Design Requirements 3.3 Sample Heat Sinks and Attachment MethodsThermal Design of Platforms Using the AMD Processor-In-a Material Thermal Design of Platforms Using the AMD Processor-In-aChapter Part DescriptionThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate Assembly3.3.2 Retention Frame Thermal Design of Platforms Using the AMD Processor-In-aChapter Chapter Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems 4.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.2 Spring ScrewsChapter 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Fin ParametersThermal Design of Custom 1U-2P Systems 4.3.4 Fans4.3.5 Thermal Interface Material ChapterThermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems 5.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 2U-4P SystemsChapter 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChemical Element of SK7 Spring Steel 5.3.2 Spring Clip5.3.3 Retention Frame 5.3.4 Heat SinkLength Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.3.5 Fans5.3.6 Thermal Interface Material ChapterThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChapter Solution for Socket F 1207 Processors Appendix AKeep-Out Drawings for Platforms Using the PIB Thermal A D V A N C E D M I C R O D E V I C E S Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A Thermal Design Guide for Socket F 1207 Processors0.787 Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A Thermal Design Guide for Socket F 1207 ProcessorsThermal Design Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Guide for Socket F 1207 ProcessorsAppendix A F 1207 PIBHeat Sink Height ZoneThermal Design Guide for Socket F 1207 Processors Keep-OutAppendix A F 1207 PIBThermal Design Guide Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Appendix AAppendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 ProcessorsAppendix B Socket F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix B Drawings for2P Systems Processor Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, and on theWindow F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket Based on theAppendix B Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Height Restriction ZoneDrawings for Keep-OutFigure 22. Socket F 1207 1U 2P Board No-Through-Hole KeepF 1207 Processor F 1207 1UAppendix B Drawings forAppendix B Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 1U-2P Systems Based on theAppendix C Socket F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix C Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for F 1207 ProcessorF 1207 Processor 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C Keep-OutDrawings for Custom 2U-4PF 1207 2U-4P Socket Outline and Socket WindowDrawings for Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Appendix CAppendix C Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for F 1207 ProcessorF 1207 Processor 1207Appendix C Drawings forAppendix C Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 2U-4P Systems Based on theFigure 30. Floor-Plan of AMD Reference Custom 2U-4P System Appendix DSocket F 1207 Processors Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System