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AMD manual Socket F 1207 Processors

Models: 1207

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Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

5.3.6 Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for

Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the

Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the

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Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on

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Contents

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AMD manual Socket F 1207 Processors, Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the

Contents

Issue Date Thermal Design Guide for Socket F 1207 ProcessorsAdvanced Micro Devices Publication #2005 Advanced Micro Devices, Inc. All rights reserved TrademarksContents Chapter 2 Processor Thermal SolutionsContents Chapter 4 Thermal Design of Custom 1U-2P SystemsSocket F 1207 Processors Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on theSocket F 1207 Processor Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesList of Tables Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Revision History Revision HistoryDate RevisionRevision History Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Chapter 1 Introduction 1.1 Summary of RequirementsChapter IntroductionThermal Design Guide for Socket F 1207 Processors IntroductionChapter Chapter 2 Processor Thermal Solutions 2.1 Processor SpecificationsMechanical and Thermal Specifications for Socket F 1207 Processors Processor Thermal SolutionsFigure 1. The 1207-Pin Socket 2.2 Socket DescriptionProcessor Thermal Solutions Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-Box PIB Thermal SolutionThermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal Solution3.3 Sample Heat Sinks and Attachment Methods 3.2 Thermal Solution Design RequirementsThermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Platforms Using the AMD Processor-In-a ChapterPart Description Material3.3.1 Backplate Assembly Thermal Design of Platforms Using the AMD Processor-In-aThermal Design of Platforms Using the AMD Processor-In-a 3.3.2 Retention FrameChapter Thermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal SolutionThermal Design Guide for Socket F 1207 Processors ChapterChapter 4 Thermal Design of Custom 1U-2P Systems 4.1 Motherboard Component Height RestrictionsThermal Design of Custom 1U-2P Systems Chapter4.2 Thermal Solution Design Requirements Thermal Solution Design Requirements for Custom 1U-2P Systems4.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 1U-2P SystemsSystems ChapterThermal Design of Custom 1U-2P Systems Quantity4.3.1 Backplate Assembly Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems4.3.2 Spring Screws Thermal Design of Custom 1U-2P Systems4.3.3 Heat Sink Figure 6. High Performance Heat Sink for Custom 1U-2P SystemsFin Parameters Chapter4.3.4 Fans Thermal Design of Custom 1U-2P SystemsChapter 4.3.5 Thermal Interface MaterialThermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 1U-2P SystemsChapter Chapter 5 Thermal Design of Custom 2U-4P Systems 5.1 Motherboard Component Height RestrictionsThermal Design of Custom 2U-4P Systems Chapter5.2 Thermal Solution Design Requirements Thermal Solution Design Requirements for Custom 2U-4P Systems5.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 2U-4P SystemsSystems ChapterThermal Design of Custom 2U-4P Systems Quantity5.3.1 Backplate Assembly Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Chapter5.3.2 Spring Clip 5.3.3 Retention Frame5.3.4 Heat Sink Chemical Element of SK7 Spring SteelFigure 10. High Performance Heat Sink for Custom 2U-4P Systems Fin ParametersThermal Design of Custom 2U-4P Systems Length5.3.5 Fans 5.3.6 Thermal Interface MaterialChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 2U-4P SystemsChapter Appendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Figure 12. Socket F 1207 PIB Board Component Height Restrictions Appendix AThermal Design Guide for Socket F 1207 Processors A D V A N C E D M I C R O D E V I C E SSocket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing Zone Appendix AThermal Design Guide for Socket F 1207 Processors 0.787Socket F 1207 PIB Socket Outline and Socket Window Appendix AGuide for Socket F 1207 Processors Thermal DesignF 1207 PIB Heat Sink HeightZone Appendix AKeep-Out Appendix AF 1207 PIB Thermal Design Guide for Socket F 1207 ProcessorsFigure 17. Socket F 1207 PIB Board Bottom Side Keep-Out ThermalAppendix A Thermal Design GuideSolution for Socket F 1207 Processors Keep-Out Drawings for Platforms Using the PIB ThermalThermal Design Guide for Socket F 1207 Processors Appendix ASocket F 1207 Processor Appendix BKeep-Out Drawings for Custom 1U-2P Systems Based on the Drawings for 2P Systems ProcessorHeight Restrictions Appendix BBased Holes, Contact Pads, andon the No-Routing ZoneF 1207 Processor Figure 20. Socket F 1207 1U-2P Socket Outline and SocketBased on the WindowFigure 21. Socket F 1207 1U-2P Heat Sink 1U-2P Systems 1207 ProcessorHeight Restriction Zone Appendix BKeep-Out Figure 22. Socket F 1207 1U2P Board No-Through-Hole Keep Drawings forF 1207 1U Appendix BDrawings for F 1207 ProcessorSocket F 1207 Processor Thermal Design Guide for Socket F 1207 ProcessorsKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor Appendix CKeep-Out Drawings for Custom 2U-4P Systems Based on the Figure 24. Socket F 1207 2U-4P Board Component Height Restrictions Drawings forF 1207 Processor Appendix C4P Mounting Holes, Contact Pads, and No-Routing Zone Appendix CKeep-Out F 1207 ProcessorCustom 2U-4P F 1207 2U-4P Socket Outline andSocket Window Drawings forFigure 27. Socket F 1207 2U-4P Heat Sink 2U-4P Systems 1207 ProcessorAppendix C Drawings forFigure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out Drawings forF 1207 Processor Appendix C1207 Appendix CDrawings for F 1207 ProcessorSocket F 1207 Processor Thermal Design Guide for Socket F 1207 ProcessorsKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CAppendix D Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemSocket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System Socket F 1207 Processors