Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

5.3.4 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

5.3.5 Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

5.3.6 Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for

Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the

Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45

Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the

Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53

Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on

Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61

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AMD 1207 manual Heat Sink Fans Thermal Interface Material