AMD 1207 manual Processor Specifications, Chapter Processor Thermal Solutions

32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors

Chapter 2 Processor Thermal Solutions

This chapter describes the thermal solutions for systems based on socket F (1207) processors.

2.1Processor Specifications

The objective of thermal solutions is to maintain the processor temperature within specified limits. Thermal performance, physical mounting, acoustic noise, mass, reliability, and cost must be considered during the design of a thermal solution.

Table 1 lists the pertinent processor specifications for a thermal solution design for systems based on socket F (1207) processors.

Table 1.	Mechanical and Thermal Specifications for Socket F (1207) Processors
Symbol	Description	Maximum	Notes
		Value
TCase	Maximum case	67°C - 72°C	Consult the processor data sheet for the
	temperature		thermal requirements specific to the
			processor.
ACPU	Processor contact	32.5 mm x	Interfaces with heat sink
	area	32.5 mm
Form	Processor form	LGA	LGA form factor for socket F (1207)
Factor	factor		processors

Chapter 2 Processor Thermal Solutions 13