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AMD 1207 manual Thermal Design of Custom 1U-2P Systems

Models: 1207

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Specs Symbol Backplate Assembly

Page 28

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

28

Thermal Design of Custom 1U-2P Systems

Chapter 4

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AMD 1207 manual Thermal Design of Custom 1U-2P Systems

Page 27 Page 29

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Contents

Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of Figures List of Figures List of Tables List of Tables List of Tables Revision History Revision History Revision History Summary of Requirements Chapter Introduction Chapter Processor Specifications Chapter Processor Thermal Solutions Socket Description 1207-Pin Socket Motherboard Component Height Restrictions Thermal Solution Design Requirements Sample Heat Sinks and Attachment Methods Part Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 1U-2P Systems Symbol Systems Exploded View of Thermal Solution for Custom 1U-2P Systems Spring Screws Heat Sink Fin Parameters Fans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 2U-4P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Spring Clip Chemical Element of SK7 Spring Steel High Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Solution for Socket F 1207 Processors Appendix a Socket F 1207 PIB Board Component Height Restrictions 787 64.36 76.41 49.91 59.81 Socket F 1207 PIB Socket Outline and Socket Window 724 000 784 520 189 1207 PIB Heat Sink Height Zone2x11.44 2x51.26 2x61.08 36.59 32.13 27.59 Keep-Out 1207 PIB318 000 885 233 Thermal10.09 33.91 49.91 Solution for Socket F 1207 Processors Appendix B Socket F 1207 Processor Drawings for 12072P Systems Processor Height Restrictions Based Holes, Contact Pads,No-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36 Based on ProcessorWindow Height Restriction Zone 1U-2P Systems 1207 Processor42.71 82.53 32.16 71.98 Keep-Out 2P Board No-Through-Hole KeepOut 598 000 166 40.59 80.41 1207 1U 233 335 96535.04 22.04 10.09 33.9 49.91 61.86 Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 4P Mounting Holes, Contact Pads, and No-Routing Zone 47.40 87.22 35.6524.54 64.36 75.47 1207 2U-4P Socket Outline Custom 2U-4PSocket Window 2U-4P Systems 1207 Processor 17.59260 681 266 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 40.59 80.41 1207 166 80.41 Socket F 1207 Processor Appendix D Socket F 1207 Processors Streamline Plot of AMD Reference Custom 2U-4P System

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