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AMD Keep-Out, Socket F 1207 1U, 2P Board No-Through-Hole Keep, Drawings for, F 1207 Processor

Models: 1207

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Keep-Out

Figure 22. Socket F (1207) 1U

8	7	6	5	4	3	2	1
N o - T h r o u g h - H o l e C o m p o n e n t Z o n e
D							D

Thermal Design Guide for Socket

Socket	Drawings for
F (1207) Processor	Custom 1U-2P Systems
	Based

-2P Board No-Through-Hole Keep-

5 1 . 3 7 2 . 0 2 2

0 . 0 0 0 . 0 0 0

1 4 . 6 3 0 . 5 7 6

P i n

1.598	0.000	3.166
40.59	0.00	80.41

F (1207) Processors

on the

Appendix B

Out

							A D V A N C E D M I C R O D E V I C E S
							A U S T I N , T E X A S
						T	IT L E :
A							S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t	A
							K e e p o u t a n d H e i g h t R e s t r i c t i o n s ,
							f o r C u s t o m 1 U / 2 P F o r m F a c t o r
N o t h r o u g h h o l e c o m p o n e n t s .						D W G . N O .		R E V
N o t h r o u g h h o l e c o m p o n e n t s .							7 9 Z 0 0 0 0 1 2 8	3 . 1
							7 9 Z 0 0 0 0 1 2 8	3 . 1
							S H E E T	5 O F 6
8	7	6	5	4	3	2	1

32800 Rev. 3.02 August 2006

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AMD Keep-Out, Socket F 1207 1U, 2P Board No-Through-Hole Keep, Drawings for, F 1207 Processor, Based, Appendix B, 1.598

Contents

Advanced Micro Devices Issue DateThermal Design Guide for Socket F 1207 Processors Publication #2005 Advanced Micro Devices, Inc. All rights reserved TrademarksContents ContentsChapter 2 Processor Thermal Solutions Chapter 4 Thermal Design of Custom 1U-2P SystemsSocket F 1207 Processor Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of Tables32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsList of Tables Date Revision HistoryRevision History Revision32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsRevision History Chapter Chapter 1 Introduction1.1 Summary of Requirements IntroductionChapter IntroductionThermal Design Guide for Socket F 1207 Processors Mechanical and Thermal Specifications for Socket F 1207 Processors Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Processor Thermal SolutionsProcessor Thermal Solutions 2.2 Socket DescriptionFigure 1. The 1207-Pin Socket Thermal Design of Platforms Using the AMD Processor-In-a Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Box PIB Thermal SolutionThermal Design of Platforms Using the AMD Processor-In-a 3.2 Thermal Solution Design Requirements3.3 Sample Heat Sinks and Attachment Methods Part Description Thermal Design of Platforms Using the AMD Processor-In-aChapter Material3.3.1 Backplate Assembly Thermal Design of Platforms Using the AMD Processor-In-aChapter 3.3.2 Retention FrameThermal Design of Platforms Using the AMD Processor-In-a Thermal Design Guide for Socket F 1207 Processors Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution ChapterThermal Design of Custom 1U-2P Systems Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Chapter4.3 Sample Heat Sinks and Attachment Methods 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems SystemsChapter Quantity4.3.2 Spring Screws 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsFin Parameters 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Chapter4.3.4 Fans Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.5 Thermal Interface MaterialChapter Chapter Thermal Design of Custom 1U-2P SystemsThermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 2U-4P Systems Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Chapter5.3 Sample Heat Sinks and Attachment Methods 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems SystemsChapter QuantityThermal Design Guide for Socket F 1207 Processors 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Chapter5.3.4 Heat Sink 5.3.2 Spring Clip5.3.3 Retention Frame Chemical Element of SK7 Spring SteelThermal Design of Custom 2U-4P Systems Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters LengthChapter 5.3.5 Fans5.3.6 Thermal Interface Material Thermal Design of Custom 2U-4P SystemsChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsAppendix A Thermal Design Guide for Socket F 1207 Processors Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A A D V A N C E D M I C R O D E V I C E SThermal Design Guide for Socket F 1207 Processors Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A 0.787Guide for Socket F 1207 Processors Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Thermal DesignZone F 1207 PIBHeat Sink Height Appendix AF 1207 PIB Keep-OutAppendix A Thermal Design Guide for Socket F 1207 ProcessorsAppendix A Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Thermal Design GuideThermal Design Guide for Socket F 1207 Processors Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Appendix AKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor Height Restrictions Drawings for2P Systems Processor Appendix Bon the BasedHoles, Contact Pads, and No-Routing ZoneBased on the F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket WindowHeight Restriction Zone Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Appendix B2P Board No-Through-Hole Keep Keep-OutFigure 22. Socket F 1207 1U Drawings forDrawings for F 1207 1UAppendix B F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Appendix BKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CSocket F 1207 Processor F 1207 Processor Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for Appendix CKeep-Out 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C F 1207 ProcessorSocket Window Custom 2U-4PF 1207 2U-4P Socket Outline and Drawings forAppendix C Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Drawings forF 1207 Processor Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for Appendix CDrawings for 1207Appendix C F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Appendix CSocket F 1207 Processors Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemAppendix D Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System Socket F 1207 Processors

Keep-Out

Figure 22. Socket F (1207) 1U

N o - T h r o u g h - H o l e C o m p o n e n t Z o n e

Custom 1U-2P Systems

-2P Board No-Through-Hole Keep-

1.598

3.166

40.59

80.41

on the