AMD 1207 manual Backplate Assembly

Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006

Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors

The following sections describe the mechanical requirements of the components shown in Figure 9.

5.3.1Backplate Assembly

For details on the backplate assembly, see section 3.3.1 on page 18.

Note: The backplate for this custom design has a mounting-hole pitch of 4.1 inches.

32 Thermal Design of Custom 2U-4P Systems Chapter 5