Thermal Design Guide for Socket F (1207) Processors | 32800 Rev. 3.00 August 2006 |
Figure 9. Exploded View of Thermal Solution for Custom
The following sections describe the mechanical requirements of the components shown in Figure 9.
5.3.1Backplate Assembly
For details on the backplate assembly, see section 3.3.1 on page 18.
Note: The backplate for this custom design has a
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