Thermal Design Guide for Socket F (1207) Processors | 32800 Rev. 3.00 August 2006 |
Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 8 on page 29. This space permits heat sink designs with better thermal performance.
Appendix C on page 53 shows a complete, detailed set of
5.2Thermal Solution Design Requirements
Table 7 provides the
Table 7. | Thermal Solution Design Requirements for Custom | ||
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| Symbol | Description | Maximum |
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| L | Length of heat sink | 92 mm |
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| W | Width of heat sink | 58 mm |
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| H | Height of heat sink | 40 mm |
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| θca | 0.26°C/W1, 2, 3 | |
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| resistance |
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| MHS | Mass of heat sink | 450 g to 700 g |
| Fclip | Clip force | 75 lbs ±15 lbs |
| TA | Local ambient temperature near | 38°C |
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| processor |
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Notes: |
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1. This is the thermal resistance required for | |||
requirement may vary depending on the product OPN. The user should consult the processor data sheet for the | |||
thermal requirements specific to the part. |
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2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied | |||
directly to the chassis for more reliable shock and vibration performance. |
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3. This chapter describes a heat sink weighing less than or equal to 450 g. Design examples of solutions up to 700 g are | |||
in development. |
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5.3Sample Heat Sinks and Attachment Methods
The following sections provide one possible thermal design solution and the specifics on attaching that solution to the motherboard.
Table 8 on page 31 lists the parts used in the thermal reference design for Custom
30 | Thermal Design of Custom | Chapter 5 |
