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AMD 1207 manual Fans, Thermal Design of Custom 1U-2P Systems

Models: 1207

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4.3.4Fans

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

Other fan and heat sink combinations may yield adequate thermal performance. The system designer must ensure that the thermal solution provides required cooling for the processor for the given system layout and flow characteristics.

Because the processor-mounting surface extends above the surface of the cam box on the socket, the heat sink bottom can be flat. The heat sink must have a flat surface of at least 40 mm x 40 mm, centered over the processor.

Figure 7 shows the measured thermal performance vs. flow rate for a slightly shorter version of this heat sink (3.5" hole pitch vs. 4.1" hole pitch). This data represents the expected performance of this heat sink on a dual-core socket F (1207) processor. Based on flow tests on the AMD reference 1U-2P system, the flow through the heat sink is estimated to be approximately 20 cubic feet per minute (CFM). Figure 7 shows that this corresponds to case-to-ambient thermal resistance of 0.24°C/W. This case-to-ambient thermal resistance has been confirmed through system thermal tests. The requirement (see Table 4 on page 22) is 0.26°C/W.

Figure 7. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor in 90 nm Process

4.3.4Fans

AMD has tested the heat sink described in Section 4.3 on page 22 with a row of five 40 mm x 50 mm x 56 mm fans (Delta Part number GFB0412EHS) in a typical 1U-2P system. The fan has a 27.3-CFM maximum flow rate and a 1.63-inches water maximum pressure head. The heat sinks are ducted so the flow from two fans enters each of the processor heat sinks.

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Thermal Design of Custom 1U-2P Systems

Chapter 4

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AMD 1207 manual Fans, Thermal Design of Custom 1U-2P Systems

Contents

Advanced Micro Devices Issue DateThermal Design Guide for Socket F 1207 Processors Publication #2005 Advanced Micro Devices, Inc. All rights reserved TrademarksContents ContentsChapter 2 Processor Thermal Solutions Chapter 4 Thermal Design of Custom 1U-2P SystemsSocket F 1207 Processor Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of Tables32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsList of Tables Date Revision HistoryRevision History Revision32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsRevision History Chapter Chapter 1 Introduction1.1 Summary of Requirements IntroductionChapter IntroductionThermal Design Guide for Socket F 1207 Processors Mechanical and Thermal Specifications for Socket F 1207 Processors Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Processor Thermal SolutionsProcessor Thermal Solutions 2.2 Socket DescriptionFigure 1. The 1207-Pin Socket Thermal Design of Platforms Using the AMD Processor-In-a Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Box PIB Thermal SolutionThermal Design of Platforms Using the AMD Processor-In-a 3.2 Thermal Solution Design Requirements3.3 Sample Heat Sinks and Attachment Methods Part Description Thermal Design of Platforms Using the AMD Processor-In-aChapter Material3.3.1 Backplate Assembly Thermal Design of Platforms Using the AMD Processor-In-aChapter 3.3.2 Retention FrameThermal Design of Platforms Using the AMD Processor-In-a Thermal Design Guide for Socket F 1207 Processors Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution ChapterThermal Design of Custom 1U-2P Systems Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Chapter4.3 Sample Heat Sinks and Attachment Methods 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems SystemsChapter Quantity4.3.2 Spring Screws 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsFin Parameters 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Chapter4.3.4 Fans Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.5 Thermal Interface MaterialChapter Chapter Thermal Design of Custom 1U-2P SystemsThermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 2U-4P Systems Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Chapter5.3 Sample Heat Sinks and Attachment Methods 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems SystemsChapter QuantityThermal Design Guide for Socket F 1207 Processors 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Chapter5.3.4 Heat Sink 5.3.2 Spring Clip5.3.3 Retention Frame Chemical Element of SK7 Spring SteelThermal Design of Custom 2U-4P Systems Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters LengthChapter 5.3.5 Fans5.3.6 Thermal Interface Material Thermal Design of Custom 2U-4P SystemsChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsAppendix A Thermal Design Guide for Socket F 1207 Processors Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A A D V A N C E D M I C R O D E V I C E SThermal Design Guide for Socket F 1207 Processors Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A 0.787Guide for Socket F 1207 Processors Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Thermal DesignZone F 1207 PIBHeat Sink Height Appendix AF 1207 PIB Keep-OutAppendix A Thermal Design Guide for Socket F 1207 ProcessorsAppendix A Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Thermal Design GuideThermal Design Guide for Socket F 1207 Processors Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Appendix AKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor Height Restrictions Drawings for2P Systems Processor Appendix Bon the BasedHoles, Contact Pads, and No-Routing ZoneBased on the F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket WindowHeight Restriction Zone Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Appendix B2P Board No-Through-Hole Keep Keep-OutFigure 22. Socket F 1207 1U Drawings forDrawings for F 1207 1UAppendix B F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Appendix BKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CSocket F 1207 Processor F 1207 Processor Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for Appendix CKeep-Out 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C F 1207 ProcessorSocket Window Custom 2U-4PF 1207 2U-4P Socket Outline and Drawings forAppendix C Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Drawings forF 1207 Processor Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for Appendix CDrawings for 1207Appendix C F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Appendix CSocket F 1207 Processors Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemAppendix D Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System Socket F 1207 Processors