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AMD 1207 manual Thermal Design of Custom 2U-4P Systems, Motherboard Component Height Restrictions

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Chapter 5 Thermal Design of Custom 2U-4P Systems

32800 Rev. 3.02 August 2006

Thermal Design Guide for Socket F (1207) Processors

Chapter 5 Thermal Design of Custom 2U-4P Systems

This chapter describes the motherboard component-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 2U-4P systems based on socket F (1207) processors.

Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and acoustic performance in these systems. These keep-outs are not compliant with AMD Processor-In-a-Box (PIB) thermal solutions.

5.1Motherboard Component Height Restrictions

The mounting solution for the heat sink calls for a standard motherboard keep-out region and mounting holes for the processor. Figure 8 shows an overview of the motherboard component height restrictions for custom 2U-4P systems based on the thermal solution for socket F (1207) processors.

Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems

Chapter 5

Thermal Design of Custom 2U-4P Systems

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AMD 1207 manual Thermal Design of Custom 2U-4P Systems, Motherboard Component Height Restrictions, Chapter

Contents

Thermal Design Guide for Socket F 1207 Processors Issue DateAdvanced Micro Devices Publication #Trademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 2 Processor Thermal Solutions ContentsContents Chapter 4 Thermal Design of Custom 1U-2P SystemsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorsSocket F 1207 Processor Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of Tables32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsList of Tables Revision History Revision HistoryDate Revision32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsRevision History 1.1 Summary of Requirements Chapter 1 IntroductionChapter IntroductionChapter IntroductionThermal Design Guide for Socket F 1207 Processors 2.1 Processor Specifications Chapter 2 Processor Thermal SolutionsMechanical and Thermal Specifications for Socket F 1207 Processors Processor Thermal SolutionsProcessor Thermal Solutions 2.2 Socket DescriptionFigure 1. The 1207-Pin Socket the AMD Processor-In-a-Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms UsingThermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal SolutionThermal Design of Platforms Using the AMD Processor-In-a 3.2 Thermal Solution Design Requirements3.3 Sample Heat Sinks and Attachment Methods Chapter Thermal Design of Platforms Using the AMD Processor-In-aPart Description MaterialThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate AssemblyChapter 3.3.2 Retention FrameThermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-aThermal Design Guide for Socket F 1207 Processors Chapter4.1 Motherboard Component Height Restrictions Chapter 4 Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems ChapterThermal Solution Design Requirements for Custom 1U-2P Systems 4.2 Thermal Solution Design Requirements4.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 1U-2P SystemsChapter SystemsThermal Design of Custom 1U-2P Systems QuantityFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.1 Backplate Assembly4.3.2 Spring Screws Thermal Design of Custom 1U-2P SystemsFigure 6. High Performance Heat Sink for Custom 1U-2P Systems 4.3.3 Heat SinkFin Parameters ChapterThermal Design of Custom 1U-2P Systems 4.3.4 FansThermal Design of Custom 1U-2P Systems 4.3.5 Thermal Interface MaterialChapter Chapter Thermal Design of Custom 1U-2P SystemsThermal Design Guide for Socket F 1207 Processors 5.1 Motherboard Component Height Restrictions Chapter 5 Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems ChapterThermal Solution Design Requirements for Custom 2U-4P Systems 5.2 Thermal Solution Design Requirements5.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 2U-4P SystemsChapter SystemsThermal Design of Custom 2U-4P Systems QuantityThermal Design of Custom 2U-4P Systems 5.3.1 Backplate AssemblyThermal Design Guide for Socket F 1207 Processors Chapter5.3.3 Retention Frame 5.3.2 Spring Clip5.3.4 Heat Sink Chemical Element of SK7 Spring SteelFin Parameters Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems Length5.3.6 Thermal Interface Material 5.3.5 FansChapter Thermal Design of Custom 2U-4P SystemsChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsAppendix A Appendix A Figure 12. Socket F 1207 PIB Board Component Height RestrictionsThermal Design Guide for Socket F 1207 Processors A D V A N C E D M I C R O D E V I C E SAppendix A Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneThermal Design Guide for Socket F 1207 Processors 0.787Appendix A Socket F 1207 PIB Socket Outline and Socket WindowGuide for Socket F 1207 Processors Thermal DesignHeat Sink Height F 1207 PIBZone Appendix AAppendix A Keep-OutF 1207 PIB Thermal Design Guide for Socket F 1207 ProcessorsThermal Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutAppendix A Thermal Design GuideKeep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsThermal Design Guide for Socket F 1207 Processors Appendix AKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor 2P Systems Processor Drawings forHeight Restrictions Appendix BHoles, Contact Pads, and Basedon the No-Routing ZoneFigure 20. Socket F 1207 1U-2P Socket Outline and Socket F 1207 ProcessorBased on the Window1U-2P Systems 1207 Processor Figure 21. Socket F 1207 1U-2P Heat SinkHeight Restriction Zone Appendix BFigure 22. Socket F 1207 1U Keep-Out2P Board No-Through-Hole Keep Drawings forAppendix B F 1207 1UDrawings for F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Socket F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CSocket F 1207 Processor Drawings for Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsF 1207 Processor Appendix CAppendix C 4P Mounting Holes, Contact Pads, and No-Routing ZoneKeep-Out F 1207 ProcessorF 1207 2U-4P Socket Outline and Custom 2U-4PSocket Window Drawings for2U-4P Systems 1207 Processor Figure 27. Socket F 1207 2U-4P Heat SinkAppendix C Drawings forDrawings for Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutF 1207 Processor Appendix CAppendix C 1207Drawings for F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Socket F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CSocket F 1207 Processors Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemAppendix D Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System