42

Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors

Appendix A

Figure 16.

 

Socket

D

F (1207) PIB

 

Board

C

No-Through-Hole

B

Keep-Out

 

 

A

8

7

6

5

4

3

2

1

N o - T h r o u g h - H o l e C o m p o n e n t s Z o n e

D

4

9

. 3

7

1

. 9 4

4

 

 

 

 

 

 

C

P i n A 1

 

 

 

 

 

 

0

. 0 0

 

0 . 0 0 0

 

1

2

. 6

3

0

. 4 9

7

1.318

 

0.000

2.885

B

 

 

 

 

 

 

33.47

 

0.00

73.29

 

 

 

 

 

 

 

 

A D V A N C E D M I C R O D E V I C E S

 

 

 

 

 

 

T I T L E :

A U S T I N , T E X A S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t

A

 

 

 

 

 

 

K e e p o u t a n d H e i g h t R e s t r i c t i o n s C o m p l i a n t

 

 

 

 

 

 

 

w i t h A M

D P I B

 

N o t h r o u g h h o l e c o m p o n e n t s

 

 

 

 

 

D W G .

N O .

R E V

 

 

 

 

 

7 9 Z 0 0 0 0 1 2 4

2 . 1

 

 

 

 

 

 

 

 

 

 

 

 

 

S H E E T 5

O F 6

8

7

6

5

4

3

2

1

 

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

Page 42
Image 42
AMD manual 1207 PIB, Keep-Out, 318 000 885