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AMD Keep-Out, Appendix A, F 1207 PIB, Thermal Design Guide for Socket F 1207 Processors, Board

Models: 1207

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Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors

Appendix A

	Figure 16.
	Socket	D
	F (1207) PIB	D
	F (1207) PIB
	Board	C
	No-Through-Hole	B
	Keep-Out
		A

N o - T h r o u g h - H o l e C o m p o n e n t s Z o n e

4	9	. 3	7	1	. 9 4	4
						C
P i n A 1
0	. 0 0			0 . 0 0 0
1	2	. 6	3	0	. 4 9	7

1.318	0.000	2.885	B

33.47	0.00	73.29

							A D V A N C E D M I C R O D E V I C E S
						T I T L E :	A U S T I N , T E X A S
						T I T L E :
						S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t		A
						K e e p o u t a n d H e i g h t R e s t r i c t i o n s C o m p l i a n t
						w i t h A M	D P I B
N o t h r o u g h h o l e c o m p o n e n t s						D W G .	N O .	R E V
N o t h r o u g h h o l e c o m p o n e n t s						7 9 Z 0 0 0 0 1 2 4		2 . 1
						7 9 Z 0 0 0 0 1 2 4		2 . 1
							S H E E T 5	O F 6
8	7	6	5	4	3	2	1

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

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AMD Keep-Out, Appendix A, F 1207 PIB, Thermal Design Guide for Socket F 1207 Processors, Board, No-Through-Hole, 1.318

Contents

Advanced Micro Devices Issue DateThermal Design Guide for Socket F 1207 Processors Publication #2005 Advanced Micro Devices, Inc. All rights reserved TrademarksContents ContentsChapter 2 Processor Thermal Solutions Chapter 4 Thermal Design of Custom 1U-2P SystemsSocket F 1207 Processor Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesThermal Design Guide for Socket F 1207 Processors List of Tables32800 Rev. 3.02 August Date Revision HistoryRevision History RevisionThermal Design Guide for Socket F 1207 Processors Revision History32800 Rev. 3.02 August Chapter Chapter 1 Introduction1.1 Summary of Requirements IntroductionIntroduction Thermal Design Guide for Socket F 1207 ProcessorsChapter Mechanical and Thermal Specifications for Socket F 1207 Processors Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Processor Thermal Solutions2.2 Socket Description Figure 1. The 1207-Pin SocketProcessor Thermal Solutions Thermal Design of Platforms Using the AMD Processor-In-a Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Box PIB Thermal Solution3.2 Thermal Solution Design Requirements 3.3 Sample Heat Sinks and Attachment MethodsThermal Design of Platforms Using the AMD Processor-In-a Part Description Thermal Design of Platforms Using the AMD Processor-In-aChapter Material3.3.1 Backplate Assembly Thermal Design of Platforms Using the AMD Processor-In-a3.3.2 Retention Frame Thermal Design of Platforms Using the AMD Processor-In-aChapter Thermal Design Guide for Socket F 1207 Processors Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution ChapterThermal Design of Custom 1U-2P Systems Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Chapter4.3 Sample Heat Sinks and Attachment Methods 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems SystemsChapter Quantity4.3.2 Spring Screws 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsFin Parameters 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Chapter4.3.4 Fans Thermal Design of Custom 1U-2P Systems4.3.5 Thermal Interface Material ChapterThermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 ProcessorsChapter Thermal Design of Custom 2U-4P Systems Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Chapter5.3 Sample Heat Sinks and Attachment Methods 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems SystemsChapter QuantityThermal Design Guide for Socket F 1207 Processors 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Chapter5.3.4 Heat Sink 5.3.2 Spring Clip5.3.3 Retention Frame Chemical Element of SK7 Spring SteelThermal Design of Custom 2U-4P Systems Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters LengthChapter 5.3.5 Fans5.3.6 Thermal Interface Material Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChapter Solution for Socket F 1207 Processors Appendix AKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 Processors Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A A D V A N C E D M I C R O D E V I C E SThermal Design Guide for Socket F 1207 Processors Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A 0.787Guide for Socket F 1207 Processors Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Thermal DesignZone F 1207 PIBHeat Sink Height Appendix AF 1207 PIB Keep-OutAppendix A Thermal Design Guide for Socket F 1207 ProcessorsAppendix A Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Thermal Design GuideThermal Design Guide for Socket F 1207 Processors Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Appendix AAppendix B Socket F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Height Restrictions Drawings for2P Systems Processor Appendix Bon the BasedHoles, Contact Pads, and No-Routing ZoneBased on the F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket WindowHeight Restriction Zone Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Appendix B2P Board No-Through-Hole Keep Keep-OutFigure 22. Socket F 1207 1U Drawings forDrawings for F 1207 1UAppendix B F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Appendix BAppendix C Socket F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the F 1207 Processor Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for Appendix CKeep-Out 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C F 1207 ProcessorSocket Window Custom 2U-4PF 1207 2U-4P Socket Outline and Drawings forAppendix C Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Drawings forF 1207 Processor Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for Appendix CDrawings for 1207Appendix C F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Appendix CFigure 30. Floor-Plan of AMD Reference Custom 2U-4P System Appendix DSocket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System Socket F 1207 Processors