Motherboard Component Height Restrictions | AMD 1207 manual

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Chapter 3 Thermal Design of Platforms Using

the AMD Processor-In-a-Box (PIB)

Thermal Solution

This chapter describes the motherboard component height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for platforms using the AMD Processor-In- a-Box (PIB) thermal solution for socket F (1207) processors.

3.1Motherboard Component Height Restrictions

The mounting solution for the heat sink calls for a standard motherboard keep-out region and mounting holes for the processor. Figure 2 shows an overview of the motherboard component height restrictions for platforms using the PIB thermal solution for socket F (1207) processors.

Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solution

Chapter 3

Thermal Design of Platforms Using the AMD Processor-In-a-

15

Box (PIB) Thermal Solution

Image 15

AMD 1207 manual Motherboard Component Height Restrictions

Contents

Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of Figures List of Figures List of Tables List of Tables List of Tables Revision History Revision History Revision History Chapter Introduction Summary of Requirements Chapter Chapter Processor Thermal Solutions Processor Specifications 1207-Pin Socket Socket Description Motherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design Requirements Part Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P Systems Symbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P Systems Fin Parameters Heat Sink Fans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P Systems Thermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring Clip High Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 Processors Socket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787 724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket Window 36.59 32.13 27.59 1207 PIB Heat Sink HeightZone 2x11.44 2x51.26 2x61.08 1207 PIB Keep-Out318 000 885 Thermal 23310.09 33.91 49.91 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix B Height Restrictions Drawings for1207 2P Systems Processor 32.16 71.98 24.54 10.09 49.91 64.36 BasedHoles, Contact Pads, No-Routing Zone Processor Based onWindow 1U-2P Systems 1207 Processor Height Restriction Zone42.71 82.53 32.16 71.98 598 000 166 40.59 80.41 Keep-Out2P Board No-Through-Hole Keep Out 22.04 10.09 33.9 49.91 61.86 1207 1U233 335 965 35.04 Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 75.47 4P Mounting Holes, Contact Pads, and No-Routing Zone47.40 87.22 35.65 24.54 64.36 Custom 2U-4P 1207 2U-4P Socket OutlineSocket Window 681 266 2U-4P Systems 1207 Processor17.59 260 40.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 166 80.41 1207 Socket F 1207 Processor Socket F 1207 Processors Appendix D Streamline Plot of AMD Reference Custom 2U-4P System