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AMD 1207 manual Thermal Design of Platforms Using, the AMD Processor-In-a-Box PIB Thermal Solution

Models: 1207

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Chapter 3 Thermal Design of Platforms Using

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Chapter 3 Thermal Design of Platforms Using

the AMD Processor-In-a-Box (PIB)

Thermal Solution

This chapter describes the motherboard component height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for platforms using the AMD Processor-In- a-Box (PIB) thermal solution for socket F (1207) processors.

3.1Motherboard Component Height Restrictions

The mounting solution for the heat sink calls for a standard motherboard keep-out region and mounting holes for the processor. Figure 2 shows an overview of the motherboard component height restrictions for platforms using the PIB thermal solution for socket F (1207) processors.

Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB Thermal Solution

Chapter 3

Thermal Design of Platforms Using the AMD Processor-In-a-

Box (PIB) Thermal Solution

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AMD 1207 manual Thermal Design of Platforms Using, the AMD Processor-In-a-Box PIB Thermal Solution, Chapter

Contents

Publication # Issue DateThermal Design Guide for Socket F 1207 Processors Advanced Micro DevicesTrademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 4 Thermal Design of Custom 1U-2P Systems ContentsChapter 2 Processor Thermal Solutions ContentsAppendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesThermal Design Guide for Socket F 1207 Processors List of Tables32800 Rev. 3.02 August Revision Revision HistoryRevision History DateThermal Design Guide for Socket F 1207 Processors Revision History32800 Rev. 3.02 August Introduction Chapter 1 Introduction1.1 Summary of Requirements ChapterIntroduction Thermal Design Guide for Socket F 1207 ProcessorsChapter Processor Thermal Solutions Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Mechanical and Thermal Specifications for Socket F 1207 Processors2.2 Socket Description Figure 1. The 1207-Pin SocketProcessor Thermal Solutions Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-a3.2 Thermal Solution Design Requirements 3.3 Sample Heat Sinks and Attachment MethodsThermal Design of Platforms Using the AMD Processor-In-a Material Thermal Design of Platforms Using the AMD Processor-In-aChapter Part DescriptionThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate Assembly3.3.2 Retention Frame Thermal Design of Platforms Using the AMD Processor-In-aChapter Chapter Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems 4.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.2 Spring ScrewsChapter 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Fin ParametersThermal Design of Custom 1U-2P Systems 4.3.4 Fans4.3.5 Thermal Interface Material ChapterThermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems 5.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 2U-4P SystemsChapter 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChemical Element of SK7 Spring Steel 5.3.2 Spring Clip5.3.3 Retention Frame 5.3.4 Heat SinkLength Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.3.5 Fans5.3.6 Thermal Interface Material ChapterThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChapter Solution for Socket F 1207 Processors Appendix AKeep-Out Drawings for Platforms Using the PIB Thermal A D V A N C E D M I C R O D E V I C E S Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A Thermal Design Guide for Socket F 1207 Processors0.787 Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A Thermal Design Guide for Socket F 1207 ProcessorsThermal Design Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Guide for Socket F 1207 ProcessorsAppendix A F 1207 PIBHeat Sink Height ZoneThermal Design Guide for Socket F 1207 Processors Keep-OutAppendix A F 1207 PIBThermal Design Guide Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Appendix AAppendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 ProcessorsAppendix B Socket F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix B Drawings for2P Systems Processor Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, and on theWindow F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket Based on theAppendix B Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Height Restriction ZoneDrawings for Keep-OutFigure 22. Socket F 1207 1U 2P Board No-Through-Hole KeepF 1207 Processor F 1207 1UAppendix B Drawings forAppendix B Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 1U-2P Systems Based on theAppendix C Socket F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix C Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for F 1207 ProcessorF 1207 Processor 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C Keep-OutDrawings for Custom 2U-4PF 1207 2U-4P Socket Outline and Socket WindowDrawings for Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Appendix CAppendix C Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for F 1207 ProcessorF 1207 Processor 1207Appendix C Drawings forAppendix C Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 2U-4P Systems Based on theFigure 30. Floor-Plan of AMD Reference Custom 2U-4P System Appendix DSocket F 1207 Processors Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System