Streamline Plot of AMD Reference Custom 2U-4P System | AMD 1207

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.00 August 2006

Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System

Thermal simulation of the 2U-4P system shown in Figure 30 on page 61 with the heat sink and fan described in Chapter 5 on page 29 predicts a flow rate through the heat sink of approximately 18 CFM and an air inlet temperature at the processor heat sinks of 3°C above external ambient temperature.

62	Flow Simulation Results for Custom 2U-4P Systems Based on	Appendix D
	Socket F (1207) Processors

Image 62

AMD 1207 manual Streamline Plot of AMD Reference Custom 2U-4P System

Contents

Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of Figures List of Figures List of Tables List of Tables List of Tables Revision History Revision History Revision History Summary of Requirements Chapter Introduction Chapter Processor Specifications Chapter Processor Thermal Solutions Socket Description 1207-Pin Socket Motherboard Component Height Restrictions Thermal Solution Design Requirements Sample Heat Sinks and Attachment Methods Part Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 1U-2P Systems Symbol Systems Exploded View of Thermal Solution for Custom 1U-2P Systems Spring Screws Heat Sink Fin Parameters Fans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 2U-4P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Spring Clip Chemical Element of SK7 Spring Steel High Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Solution for Socket F 1207 Processors Appendix a Socket F 1207 PIB Board Component Height Restrictions 787 64.36 76.41 49.91 59.81 Socket F 1207 PIB Socket Outline and Socket Window 724 000 784 520 189 2x11.44 2x51.26 2x61.08 1207 PIB Heat Sink HeightZone 36.59 32.13 27.59 318 000 885 1207 PIBKeep-Out 10.09 33.91 49.91 Thermal233 Solution for Socket F 1207 Processors Appendix B Socket F 1207 Processor 2P Systems Processor Drawings for1207 Height Restrictions No-Routing Zone BasedHoles, Contact Pads, 32.16 71.98 24.54 10.09 49.91 64.36 Window ProcessorBased on 42.71 82.53 32.16 71.98 1U-2P Systems 1207 ProcessorHeight Restriction Zone Out Keep-Out2P Board No-Through-Hole Keep 598 000 166 40.59 80.41 35.04 1207 1U233 335 965 22.04 10.09 33.9 49.91 61.86 Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 24.54 64.36 4P Mounting Holes, Contact Pads, and No-Routing Zone47.40 87.22 35.65 75.47 Socket Window Custom 2U-4P1207 2U-4P Socket Outline 260 2U-4P Systems 1207 Processor17.59 681 266 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 40.59 80.41 1207 166 80.41 Socket F 1207 Processor Appendix D Socket F 1207 Processors Streamline Plot of AMD Reference Custom 2U-4P System