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AMD 1207 manual Introduction, Summary of Requirements, Chapter

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32800 Rev. 3.00 August 2006Thermal Design Guide for Socket F (1207) Processors

Chapter 1 Introduction

This document specifies performance requirements for the design of thermal and mechanical solutions for socket F (1207) processors, utilizing AMD 64-bit technology. Detailed drawings, descriptions, and design targets are provided to help manufacturers, vendors, and engineers meet the requirements for the socket F (1207) processors.

1.1Summary of Requirements

To allow optimal reliability of a processor, the thermal and cooling solution dissipates heat from that processor operating at the thermal design power. This document specifies the required values for the thermal and mechanical parameters of systems based on socket F (1207) processors.

Chapter 1 Introduction

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AMD 1207 manual Introduction, Summary of Requirements, Chapter

Contents

Publication # Issue DateThermal Design Guide for Socket F 1207 Processors Advanced Micro DevicesTrademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 4 Thermal Design of Custom 1U-2P Systems ContentsChapter 2 Processor Thermal Solutions ContentsAppendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of Tables32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsList of Tables Revision Revision HistoryRevision History Date32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsRevision History Introduction Chapter 1 Introduction1.1 Summary of Requirements ChapterChapter IntroductionThermal Design Guide for Socket F 1207 Processors Processor Thermal Solutions Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Mechanical and Thermal Specifications for Socket F 1207 ProcessorsProcessor Thermal Solutions 2.2 Socket DescriptionFigure 1. The 1207-Pin Socket Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-aThermal Design of Platforms Using the AMD Processor-In-a 3.2 Thermal Solution Design Requirements3.3 Sample Heat Sinks and Attachment Methods Material Thermal Design of Platforms Using the AMD Processor-In-aChapter Part DescriptionThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate AssemblyChapter 3.3.2 Retention FrameThermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems 4.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.2 Spring ScrewsChapter 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Fin ParametersThermal Design of Custom 1U-2P Systems 4.3.4 FansThermal Design of Custom 1U-2P Systems 4.3.5 Thermal Interface MaterialChapter Chapter Thermal Design of Custom 1U-2P SystemsThermal Design Guide for Socket F 1207 Processors Chapter Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems 5.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 2U-4P SystemsChapter 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChemical Element of SK7 Spring Steel 5.3.2 Spring Clip5.3.3 Retention Frame 5.3.4 Heat SinkLength Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.3.5 Fans5.3.6 Thermal Interface Material ChapterChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsAppendix A A D V A N C E D M I C R O D E V I C E S Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A Thermal Design Guide for Socket F 1207 Processors0.787 Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A Thermal Design Guide for Socket F 1207 ProcessorsThermal Design Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Guide for Socket F 1207 ProcessorsAppendix A F 1207 PIBHeat Sink Height ZoneThermal Design Guide for Socket F 1207 Processors Keep-OutAppendix A F 1207 PIBThermal Design Guide Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Appendix AAppendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 ProcessorsKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor Appendix B Drawings for2P Systems Processor Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, and on theWindow F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket Based on theAppendix B Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Height Restriction ZoneDrawings for Keep-OutFigure 22. Socket F 1207 1U 2P Board No-Through-Hole KeepF 1207 Processor F 1207 1UAppendix B Drawings forAppendix B Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 1U-2P Systems Based on theKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CSocket F 1207 Processor Appendix C Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for F 1207 ProcessorF 1207 Processor 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C Keep-OutDrawings for Custom 2U-4PF 1207 2U-4P Socket Outline and Socket WindowDrawings for Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Appendix CAppendix C Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for F 1207 ProcessorF 1207 Processor 1207Appendix C Drawings forAppendix C Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 2U-4P Systems Based on theSocket F 1207 Processors Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemAppendix D Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System