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AMD 1207 manual Thermal Solution Design Requirements, Sample Heat Sinks and Attachment Methods

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3.2Thermal Solution Design Requirements

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with better thermal performance.

Appendix A on page 37 shows a complete, detailed set of keep-out drawings for the AMD PIB thermal solution for socket F (1207).

3.2Thermal Solution Design Requirements

Table 2 provides the design-target specifications that must be met for the processor to operate reliably in a typical platform using the AMD PIB thermal solution for socket F (1207) processors.

Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB processors

Symbol	Description	Maximum

L	Length of heat sink	68 mm

W	Width of heat sink	77 mm

H	Height of heat sink	60 mm

θca	Case-to-ambient thermal	0.26°C/W1
	resistance
MHS	Mass of heat sink	450 g to 700 g2
Fclip	Clip force	75 lbs ±15 lbs
TA	Local ambient temperature near	38°C
	processor

Notes:

1. This is the thermal resistance required for dual-core, 90-nm socket F (1207) processors. The thermal resistance requirement may vary depending on the product OPN. The user should consult the processor data sheet for the thermal requirements specific to the part.

2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied directly to the chassis for reliable shock and vibration performance.

3.3Sample Heat Sinks and Attachment Methods

The heat sink, fan, mounting spring clip, and thermal interface material used for the AMD PIB thermal solution for socket F (1207) processors are the same as the heat sink, fan, mounting spring clip, and thermal interface material used for systems based on the socket 940 processor.

The backplate and retention frame are different from those used in the socket 940 processor. The EMC shield implemented in the socket 940-based systems is not recommended for AMD PIB thermal solutions for socket F (1207) processors.

16	Thermal Design of Platforms Using the AMD Processor-In-a-	Chapter 3
	Box (PIB) Thermal Solution

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AMD 1207 manual Thermal Solution Design Requirements, Sample Heat Sinks and Attachment Methods

Contents

Issue Date Thermal Design Guide for Socket F 1207 ProcessorsAdvanced Micro Devices Publication #2005 Advanced Micro Devices, Inc. All rights reserved TrademarksContents Chapter 2 Processor Thermal SolutionsContents Chapter 4 Thermal Design of Custom 1U-2P SystemsSocket F 1207 Processors Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on theSocket F 1207 Processor Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesList of Tables Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Revision History Revision HistoryDate RevisionRevision History Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Chapter 1 Introduction 1.1 Summary of RequirementsChapter IntroductionThermal Design Guide for Socket F 1207 Processors IntroductionChapter Chapter 2 Processor Thermal Solutions 2.1 Processor SpecificationsMechanical and Thermal Specifications for Socket F 1207 Processors Processor Thermal SolutionsFigure 1. The 1207-Pin Socket 2.2 Socket DescriptionProcessor Thermal Solutions Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-Box PIB Thermal SolutionThermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal Solution3.3 Sample Heat Sinks and Attachment Methods 3.2 Thermal Solution Design RequirementsThermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Platforms Using the AMD Processor-In-a ChapterPart Description Material3.3.1 Backplate Assembly Thermal Design of Platforms Using the AMD Processor-In-aThermal Design of Platforms Using the AMD Processor-In-a 3.3.2 Retention FrameChapter Thermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal SolutionThermal Design Guide for Socket F 1207 Processors ChapterChapter 4 Thermal Design of Custom 1U-2P Systems 4.1 Motherboard Component Height RestrictionsThermal Design of Custom 1U-2P Systems Chapter4.2 Thermal Solution Design Requirements Thermal Solution Design Requirements for Custom 1U-2P Systems4.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 1U-2P SystemsSystems ChapterThermal Design of Custom 1U-2P Systems Quantity4.3.1 Backplate Assembly Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems4.3.2 Spring Screws Thermal Design of Custom 1U-2P Systems4.3.3 Heat Sink Figure 6. High Performance Heat Sink for Custom 1U-2P SystemsFin Parameters Chapter4.3.4 Fans Thermal Design of Custom 1U-2P SystemsChapter 4.3.5 Thermal Interface MaterialThermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 1U-2P SystemsChapter Chapter 5 Thermal Design of Custom 2U-4P Systems 5.1 Motherboard Component Height RestrictionsThermal Design of Custom 2U-4P Systems Chapter5.2 Thermal Solution Design Requirements Thermal Solution Design Requirements for Custom 2U-4P Systems5.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 2U-4P SystemsSystems ChapterThermal Design of Custom 2U-4P Systems Quantity5.3.1 Backplate Assembly Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Chapter5.3.2 Spring Clip 5.3.3 Retention Frame5.3.4 Heat Sink Chemical Element of SK7 Spring SteelFigure 10. High Performance Heat Sink for Custom 2U-4P Systems Fin ParametersThermal Design of Custom 2U-4P Systems Length5.3.5 Fans 5.3.6 Thermal Interface MaterialChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 2U-4P SystemsChapter Appendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Figure 12. Socket F 1207 PIB Board Component Height Restrictions Appendix AThermal Design Guide for Socket F 1207 Processors A D V A N C E D M I C R O D E V I C E SSocket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing Zone Appendix AThermal Design Guide for Socket F 1207 Processors 0.787Socket F 1207 PIB Socket Outline and Socket Window Appendix AGuide for Socket F 1207 Processors Thermal DesignF 1207 PIB Heat Sink HeightZone Appendix AKeep-Out Appendix AF 1207 PIB Thermal Design Guide for Socket F 1207 ProcessorsFigure 17. Socket F 1207 PIB Board Bottom Side Keep-Out ThermalAppendix A Thermal Design GuideSolution for Socket F 1207 Processors Keep-Out Drawings for Platforms Using the PIB ThermalThermal Design Guide for Socket F 1207 Processors Appendix ASocket F 1207 Processor Appendix BKeep-Out Drawings for Custom 1U-2P Systems Based on the Drawings for 2P Systems ProcessorHeight Restrictions Appendix BBased Holes, Contact Pads, andon the No-Routing ZoneF 1207 Processor Figure 20. Socket F 1207 1U-2P Socket Outline and SocketBased on the WindowFigure 21. Socket F 1207 1U-2P Heat Sink 1U-2P Systems 1207 ProcessorHeight Restriction Zone Appendix BKeep-Out Figure 22. Socket F 1207 1U2P Board No-Through-Hole Keep Drawings forF 1207 1U Appendix BDrawings for F 1207 ProcessorSocket F 1207 Processor Thermal Design Guide for Socket F 1207 ProcessorsKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor Appendix CKeep-Out Drawings for Custom 2U-4P Systems Based on the Figure 24. Socket F 1207 2U-4P Board Component Height Restrictions Drawings forF 1207 Processor Appendix C4P Mounting Holes, Contact Pads, and No-Routing Zone Appendix CKeep-Out F 1207 ProcessorCustom 2U-4P F 1207 2U-4P Socket Outline andSocket Window Drawings forFigure 27. Socket F 1207 2U-4P Heat Sink 2U-4P Systems 1207 ProcessorAppendix C Drawings forFigure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out Drawings forF 1207 Processor Appendix C1207 Appendix CDrawings for F 1207 ProcessorSocket F 1207 Processor Thermal Design Guide for Socket F 1207 ProcessorsKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CAppendix D Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemSocket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System Socket F 1207 Processors