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AMD manual Socket F 1207 PIB Board Bottom Side Keep-Out, Appendix A, Thermal Design Guide

Models: 1207

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Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out

Appendix A

Keep-Out Drawings for Platforms Using the PIB Solution for Socket F (1207) Processors

Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out

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1 0 . 0 0	0 . 3 9 4	2 x									4 . 3 7
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32800 Rev. 3.00 August 2006

Thermal Design Guide

Thermal

43

A D V A N C E D M I C R O D E V I C E S

T I T L E :

A U S T I N , T E X A S

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for Socket F (1207) Processors

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AMD Socket F 1207 PIB Board Bottom Side Keep-Out, Appendix A, Thermal Design Guide, for Socket F 1207 Processors

Contents

Publication # Issue DateThermal Design Guide for Socket F 1207 Processors Advanced Micro DevicesTrademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 4 Thermal Design of Custom 1U-2P Systems ContentsChapter 2 Processor Thermal Solutions ContentsAppendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesList of Tables Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Revision Revision HistoryRevision History DateRevision History Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Introduction Chapter 1 Introduction1.1 Summary of Requirements ChapterThermal Design Guide for Socket F 1207 Processors IntroductionChapter Processor Thermal Solutions Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Mechanical and Thermal Specifications for Socket F 1207 ProcessorsFigure 1. The 1207-Pin Socket 2.2 Socket DescriptionProcessor Thermal Solutions Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-a3.3 Sample Heat Sinks and Attachment Methods 3.2 Thermal Solution Design RequirementsThermal Design of Platforms Using the AMD Processor-In-a Material Thermal Design of Platforms Using the AMD Processor-In-aChapter Part DescriptionThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate AssemblyThermal Design of Platforms Using the AMD Processor-In-a 3.3.2 Retention FrameChapter Chapter Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution Thermal Design Guide for Socket F 1207 ProcessorsChapter Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems 4.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.2 Spring ScrewsChapter 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Fin ParametersThermal Design of Custom 1U-2P Systems 4.3.4 FansChapter 4.3.5 Thermal Interface MaterialThermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 1U-2P SystemsChapter Chapter Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems 5.3 Sample Heat Sinks and Attachment MethodsQuantity SystemsChapter Thermal Design of Custom 2U-4P SystemsChapter 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Thermal Design Guide for Socket F 1207 ProcessorsChemical Element of SK7 Spring Steel 5.3.2 Spring Clip5.3.3 Retention Frame 5.3.4 Heat SinkLength Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems 5.3.5 Fans5.3.6 Thermal Interface Material ChapterThermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 2U-4P SystemsChapter Appendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal A D V A N C E D M I C R O D E V I C E S Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A Thermal Design Guide for Socket F 1207 Processors0.787 Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A Thermal Design Guide for Socket F 1207 ProcessorsThermal Design Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Guide for Socket F 1207 ProcessorsAppendix A F 1207 PIBHeat Sink Height ZoneThermal Design Guide for Socket F 1207 Processors Keep-OutAppendix A F 1207 PIBThermal Design Guide Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Appendix AAppendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 ProcessorsSocket F 1207 Processor Appendix BKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix B Drawings for2P Systems Processor Height RestrictionsNo-Routing Zone BasedHoles, Contact Pads, and on theWindow F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket Based on theAppendix B Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Height Restriction ZoneDrawings for Keep-OutFigure 22. Socket F 1207 1U 2P Board No-Through-Hole KeepF 1207 Processor F 1207 1UAppendix B Drawings forAppendix B Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 1U-2P Systems Based on theSocket F 1207 Processor Appendix CKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix C Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for F 1207 ProcessorF 1207 Processor 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C Keep-OutDrawings for Custom 2U-4PF 1207 2U-4P Socket Outline and Socket WindowDrawings for Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Appendix CAppendix C Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for F 1207 ProcessorF 1207 Processor 1207Appendix C Drawings forAppendix C Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Custom 2U-4P Systems Based on theAppendix D Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemSocket F 1207 Processors Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System