AMD 1207 manual Thermal, 233, 10.09 33.91 49.91

Appendix A

Keep-Out Drawings for Platforms Using the PIB Solution for Socket F (1207) Processors

Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out

D

C

B

8				7				6			5
B o a r d B o t t o m S i d e ( V i e w f r o m U n d e r s i d e o f B o a r d )
						8 . 8 0	0 . 3 4 6	4 x
						N o n - p l a t e d t h r u h o l e					1 2 . 6		3
											3 . 1 3
1 0 . 0 0	0 . 3 9 4	2 x									0 . 0 0
											4 . 3 7
N o n - p l a t e d t h r u h o l e
											1 4	. 3	7
											1 8	. 3	7
											2 2	. 3	7
											3 2	. 3	7
											3 9	. 8	7
											4 9	. 3	7
				2x		2x		2x	2x
		1.318	0.966	0.39 7	0.000	0.233		1.33 5	1.96 5	2.534	2.885
		33.47	24.54	10.09	0.00	5.91		33.91	49.91	64.36	73.29

				4		3	2	1
								D
	0	. 4 9	7
0	. 1 2 3			2 x
0	. 0 0 0
0	. 1 7 2
	0	. 5 6	6
	0	. 7 2	3		2 x			C
	0	. 8 8	1
	1	. 2 7	4
	1	. 5 7	0		2 x
	1 . 9 4		4

B

32800 Rev. 3.00 August 2006

Thermal Design Guide

Thermal

43

									A D V A N C E D M I C R O D E V I C E S
								T I T L E :	A U S T I N , T E X A S
A	0 . 0 0	[ 0 . 0 0 0	' ' ] M a x c o m p o n e n t h e i g h t ; T i e t o g r o u n d .					S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t		A
								K e e p o u t a n d H e i g h t R e s t r i c t i o n s C o m p l i a n t
	0 . 0 0	[ 0 . 0 0 0	' ' ] M a x c o m p o n e n t h e i g h t ; N o o u t e r l a y e r t r a c e s .					w i t h A M	D P I B
	0 . 0 0	[ 0 . 0 0 0	' ' ] M a x c o m p o n e n t h e i g h t .					D W G .	N O .	R E V
								7 9 Z 0 0 0 0 1 2 4		2 . 1
									S H E E T 6	O F 6
8			7	6	5	4	3	2	1

for Socket F (1207) Processors