Backplate Assembly | AMD 1207 specs

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207) Processors

3.3.1Backplate Assembly

The backplate is mounted on the backside of the motherboard and enhances local stiffness to support shock and vibration loads acting on the heat sink. The backplate assembly prevents excessive motherboard warpage in the area near the processor. Without a backplate, excessive warpage could cause serious damage to electrical connections of the processor socket and integrated circuit packages surrounding the processor. The backplate also serves as a stiffener plate for the LGA socket.

The reference backplate is made from a 1/16-inch, hard-milled steel, has an overall thickness of 0.138 inch (3.5 mm), including stiffening ribs, and has a mounting-hole pitch of 3.5 inches. To accommodate the capacitors on the backside of the board, there is a square hole in the center of the backplate.

18	Thermal Design of Platforms Using the AMD Processor-In-a-	Chapter 3
	Box (PIB) Thermal Solution

Image 18

AMD 1207 manual Backplate Assembly

Contents

Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of Figures List of Figures List of Tables List of Tables List of Tables Revision History Revision History Revision History Summary of Requirements Chapter Introduction Chapter Processor Specifications Chapter Processor Thermal Solutions Socket Description 1207-Pin Socket Motherboard Component Height Restrictions Thermal Solution Design Requirements Sample Heat Sinks and Attachment Methods Part Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 1U-2P Systems Symbol Systems Exploded View of Thermal Solution for Custom 1U-2P Systems Spring Screws Heat Sink Fin Parameters Fans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 2U-4P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Spring Clip Chemical Element of SK7 Spring Steel High Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Solution for Socket F 1207 Processors Appendix a Socket F 1207 PIB Board Component Height Restrictions 787 64.36 76.41 49.91 59.81 Socket F 1207 PIB Socket Outline and Socket Window 724 000 784 520 189 2x11.44 2x51.26 2x61.08 1207 PIB Heat Sink HeightZone 36.59 32.13 27.59 1207 PIB Keep-Out318 000 885 Thermal 23310.09 33.91 49.91 Solution for Socket F 1207 Processors Appendix B Socket F 1207 Processor 2P Systems Processor Drawings for1207 Height Restrictions No-Routing Zone BasedHoles, Contact Pads, 32.16 71.98 24.54 10.09 49.91 64.36 Processor Based onWindow 1U-2P Systems 1207 Processor Height Restriction Zone42.71 82.53 32.16 71.98 Out Keep-Out2P Board No-Through-Hole Keep 598 000 166 40.59 80.41 35.04 1207 1U233 335 965 22.04 10.09 33.9 49.91 61.86 Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 24.54 64.36 4P Mounting Holes, Contact Pads, and No-Routing Zone47.40 87.22 35.65 75.47 Custom 2U-4P 1207 2U-4P Socket OutlineSocket Window 260 2U-4P Systems 1207 Processor17.59 681 266 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 40.59 80.41 1207 166 80.41 Socket F 1207 Processor Appendix D Socket F 1207 Processors Streamline Plot of AMD Reference Custom 2U-4P System