32800 Rev. 3.02 3.00 August 2006 | Thermal Design Guide for Socket F (1207) Processors |
Chapter 4 Thermal Design of Custom 1U-2P Systems
This chapter describes the motherboard component-height restrictions, thermal-solution design requirements, sample heat sinks, and attachment methods for custom 1U-2P systems based on socket F (1207) processors.
Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and acoustic performance in these systems. These keep-outs are not compliant with AMD Processor-In-a-Box (PIB) thermal solutions.
4.1Motherboard Component Height Restrictions
The mounting solution for the heat sink calls for a standard motherboard keep-out region and mounting holes for the processor. Figure 4 shows an overview of the motherboard component height restrictions for custom 1U-2P systems based on the thermal solution for socket F (1207) processors.
Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems
Chapter 4 | Thermal Design of Custom 1U-2P Systems | 21 |