AMD 1207 manual 787, 64.36 76.41 49.91 59.81

Appendix A

Figure 13.

876

M o u n t i n g H o l e s , C o n t a c t P a d s , a n d N o - R o u t i n g Z o n e V i e w

5 4 3 2 1

32800 Rev. 3.00

Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors

39

Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone

D

C

B

A

C

P i n A 1

R 6 . 9 5 0 . 2 7 4 2 x

		2x		2x
1.441	0.966				0.000
		0.787	0.39 7
36.59	24.54				0.00
		19.99	10.09

0 . 0 0	[ 0 . 0 0 0 ' ' ] M a x c o m p o n e n t					h e i g h t ; T i e t o g r o u n d .
0 . 0 0	[ 0 . 0 0 0 ' ' ]	M	a x	c o m	p o n e n t h e i g h t ; N o o u t e r l a y e r t r a c e s .
0 . 0 0	[ 0 . 0 0 0 ' ' ]	M	a x	c o m	p o n e n t	h e i g h t .
8						7	6

3 . 5 0 0 . 1 3 8 3 x

			B
			5 3 . 3 7	2 . 1 0 1	2 x
			3 9 . 8 7	1 . 5 7 0	2 x
	A		2 5 . 3 2	0 . 9 9 7	2 x
			1 8 . 3 7	0 . 7 2 3	2 x
			1 1 . 4 2	0 . 4 5 0	2 x
			0 . 0 0	0 . 0 0 0
			3 . 1 3	0 . 1 2 3	2 x
			1 6 . 6 3	0 . 6 5 5	2 x
2x	2x
5	5	2.534	3.008
1.96	2.35	64.36	76.41
49.91	59.81

5 4 3

N o n - p l a t e d m o u n t i n g h o l e

D

						R 2 . 9 7		0 . 1 1 7
D	E T A I L		A		R 1 . 2 5		0 . 0 4 9		3 x
				2 x
S C A L E			2	: 1
					S o l d e r c o a t e d c o p p e r
						3 . 6 0		0 . 1 4 2		C
						6 . 0 0		0 . 2 3 6
D	E T A I L		B	4 x
S C		A L E	2	:	1
							8 . 8 0		0 . 3 4 6
							5 . 9 0		0 . 2 3 2
										B
						N o n - p l a t e d m o u n t i n g h o l e
	D	E T A I L		C	4 x
	S C A L E			2	: 1
							A D V A N C E D M I C R O D E V I C E S
					T IT L E :				A U S T I N , T E X A S
					S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t					A
					K e e p o u t a n d H e i g h t R e s t r i c t i o n s C o m p l i a n t
					w i t h A M	D	P I B
					D W G .	N O .			R E V
					7 9 Z 0 0 0 0 1 2 4				2 . 1
									S H E E T 2 O F	6
				2					1

August 2006

Thermal Design Guide for Socket F (1207) Processors