Manuals
/
AMD
/
Computer Equipment
/
Computer Hardware
AMD
Thermal Design Guide for Socket F 1207 Processors, List of Tables, 32800 Rev. 3.02 August
Models:
1207
1
8
62
62
Download
62 pages
47.59 Kb
5
6
7
8
9
10
11
12
<
>
Specifications
Issue Date
Backplate Assembly
Processor Thermal Solutions
Thermal Design of Platforms Using
Page 8
Image 8
Thermal Design Guide for Socket F (1207) Processors
32800 Rev. 3.02 August 2006
8
List of Tables
Page 7
Page 9
Page 8
Image 8
Page 7
Page 9
Contents
Issue Date
Thermal Design Guide for Socket F 1207 Processors
Advanced Micro Devices
Publication #
2005 Advanced Micro Devices, Inc. All rights reserved
Trademarks
Contents
Chapter 2 Processor Thermal Solutions
Contents
Chapter 4 Thermal Design of Custom 1U-2P Systems
Socket F 1207 Processors
Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the
Socket F 1207 Processor
Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the
List of Figures
List of Figures
Figure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System
List of Tables
List of Tables
32800 Rev. 3.02 August
Thermal Design Guide for Socket F 1207 Processors
List of Tables
Revision History
Revision History
Date
Revision
32800 Rev. 3.02 August
Thermal Design Guide for Socket F 1207 Processors
Revision History
Chapter 1 Introduction
1.1 Summary of Requirements
Chapter
Introduction
Chapter
Introduction
Thermal Design Guide for Socket F 1207 Processors
Chapter 2 Processor Thermal Solutions
2.1 Processor Specifications
Mechanical and Thermal Specifications for Socket F 1207 Processors
Processor Thermal Solutions
Processor Thermal Solutions
2.2 Socket Description
Figure 1. The 1207-Pin Socket
Chapter 3 Thermal Design of Platforms Using
the AMD Processor-In-a-Box PIB Thermal Solution
Thermal Design of Platforms Using the AMD Processor-In-a
Box PIB Thermal Solution
Thermal Design of Platforms Using the AMD Processor-In-a
3.2 Thermal Solution Design Requirements
3.3 Sample Heat Sinks and Attachment Methods
Thermal Design of Platforms Using the AMD Processor-In-a
Chapter
Part Description
Material
3.3.1 Backplate Assembly
Thermal Design of Platforms Using the AMD Processor-In-a
Chapter
3.3.2 Retention Frame
Thermal Design of Platforms Using the AMD Processor-In-a
Thermal Design of Platforms Using the AMD Processor-In-a
Box PIB Thermal Solution
Thermal Design Guide for Socket F 1207 Processors
Chapter
Chapter 4 Thermal Design of Custom 1U-2P Systems
4.1 Motherboard Component Height Restrictions
Thermal Design of Custom 1U-2P Systems
Chapter
4.2 Thermal Solution Design Requirements
Thermal Solution Design Requirements for Custom 1U-2P Systems
4.3 Sample Heat Sinks and Attachment Methods
Thermal Design of Custom 1U-2P Systems
Systems
Chapter
Thermal Design of Custom 1U-2P Systems
Quantity
4.3.1 Backplate Assembly
Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems
4.3.2 Spring Screws
Thermal Design of Custom 1U-2P Systems
4.3.3 Heat Sink
Figure 6. High Performance Heat Sink for Custom 1U-2P Systems
Fin Parameters
Chapter
4.3.4 Fans
Thermal Design of Custom 1U-2P Systems
Thermal Design of Custom 1U-2P Systems
4.3.5 Thermal Interface Material
Chapter
Chapter
Thermal Design of Custom 1U-2P Systems
Thermal Design Guide for Socket F 1207 Processors
Chapter 5 Thermal Design of Custom 2U-4P Systems
5.1 Motherboard Component Height Restrictions
Thermal Design of Custom 2U-4P Systems
Chapter
5.2 Thermal Solution Design Requirements
Thermal Solution Design Requirements for Custom 2U-4P Systems
5.3 Sample Heat Sinks and Attachment Methods
Thermal Design of Custom 2U-4P Systems
Systems
Chapter
Thermal Design of Custom 2U-4P Systems
Quantity
5.3.1 Backplate Assembly
Thermal Design of Custom 2U-4P Systems
Thermal Design Guide for Socket F 1207 Processors
Chapter
5.3.2 Spring Clip
5.3.3 Retention Frame
5.3.4 Heat Sink
Chemical Element of SK7 Spring Steel
Figure 10. High Performance Heat Sink for Custom 2U-4P Systems
Fin Parameters
Thermal Design of Custom 2U-4P Systems
Length
5.3.5 Fans
5.3.6 Thermal Interface Material
Chapter
Thermal Design of Custom 2U-4P Systems
Chapter
Thermal Design of Custom 2U-4P Systems
Thermal Design Guide for Socket F 1207 Processors
Keep-Out Drawings for Platforms Using the PIB Thermal
Solution for Socket F 1207 Processors
Appendix A
Figure 12. Socket F 1207 PIB Board Component Height Restrictions
Appendix A
Thermal Design Guide for Socket F 1207 Processors
A D V A N C E D M I C R O D E V I C E S
Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing Zone
Appendix A
Thermal Design Guide for Socket F 1207 Processors
0.787
Socket F 1207 PIB Socket Outline and Socket Window
Appendix A
Guide for Socket F 1207 Processors
Thermal Design
F 1207 PIB
Heat Sink Height
Zone
Appendix A
Keep-Out
Appendix A
F 1207 PIB
Thermal Design Guide for Socket F 1207 Processors
Figure 17. Socket F 1207 PIB Board Bottom Side Keep-Out
Thermal
Appendix A
Thermal Design Guide
Solution for Socket F 1207 Processors
Keep-Out Drawings for Platforms Using the PIB Thermal
Thermal Design Guide for Socket F 1207 Processors
Appendix A
Keep-Out Drawings for Custom 1U-2P Systems Based on the
Appendix B
Socket F 1207 Processor
Drawings for
2P Systems Processor
Height Restrictions
Appendix B
Based
Holes, Contact Pads, and
on the
No-Routing Zone
F 1207 Processor
Figure 20. Socket F 1207 1U-2P Socket Outline and Socket
Based on the
Window
Figure 21. Socket F 1207 1U-2P Heat Sink
1U-2P Systems 1207 Processor
Height Restriction Zone
Appendix B
Keep-Out
Figure 22. Socket F 1207 1U
2P Board No-Through-Hole Keep
Drawings for
F 1207 1U
Appendix B
Drawings for
F 1207 Processor
Socket F 1207 Processor
Thermal Design Guide for Socket F 1207 Processors
Keep-Out Drawings for Custom 1U-2P Systems Based on the
Appendix B
Keep-Out Drawings for Custom 2U-4P Systems Based on the
Appendix C
Socket F 1207 Processor
Figure 24. Socket F 1207 2U-4P Board Component Height Restrictions
Drawings for
F 1207 Processor
Appendix C
4P Mounting Holes, Contact Pads, and No-Routing Zone
Appendix C
Keep-Out
F 1207 Processor
Custom 2U-4P
F 1207 2U-4P Socket Outline and
Socket Window
Drawings for
Figure 27. Socket F 1207 2U-4P Heat Sink
2U-4P Systems 1207 Processor
Appendix C
Drawings for
Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out
Drawings for
F 1207 Processor
Appendix C
1207
Appendix C
Drawings for
F 1207 Processor
Socket F 1207 Processor
Thermal Design Guide for Socket F 1207 Processors
Keep-Out Drawings for Custom 2U-4P Systems Based on the
Appendix C
Socket F 1207 Processors
Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System
Appendix D
Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System
Socket F 1207 Processors