Appendix D, Socket F 1207 Processors | AMD instruction

32800 Rev. 3.02 August 2006

Thermal Design Guide for Socket F (1207) Processors

Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on Socket F (1207) Processors

Appendix D describes the flow simulation results for 2U-4P systems based on socket F (1207) processors.

Figure 30 shows a floor plan of an AMD reference custom 2U-4P system.

Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System

Figure 31 shows a streamline plot of an AMD reference 2U-4P system.

Appendix D	Flow Simulation Results for Custom 2U-4P Systems Based on	61
	Socket F (1207) Processors

Image 61

AMD manual Appendix D, Socket F 1207 Processors

Contents

Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of Figures List of Figures List of Tables List of Tables List of Tables Revision History Revision History Revision History Chapter Introduction Summary of Requirements Chapter Chapter Processor Thermal Solutions Processor Specifications 1207-Pin Socket Socket Description Motherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design Requirements Part Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P Systems Symbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P Systems Fin Parameters Heat Sink Fans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P Systems Thermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring Clip High Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 Processors Socket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787 724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket Window Zone 1207 PIB Heat Sink Height2x11.44 2x51.26 2x61.08 36.59 32.13 27.59 Keep-Out 1207 PIB318 000 885 233 Thermal10.09 33.91 49.91 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix B 1207 Drawings for2P Systems Processor Height Restrictions Holes, Contact Pads, BasedNo-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36 Based on ProcessorWindow Height Restriction Zone 1U-2P Systems 1207 Processor42.71 82.53 32.16 71.98 2P Board No-Through-Hole Keep Keep-OutOut 598 000 166 40.59 80.41 233 335 965 1207 1U35.04 22.04 10.09 33.9 49.91 61.86 Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 47.40 87.22 35.65 4P Mounting Holes, Contact Pads, and No-Routing Zone24.54 64.36 75.47 1207 2U-4P Socket Outline Custom 2U-4PSocket Window 17.59 2U-4P Systems 1207 Processor260 681 266 40.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 166 80.41 1207 Socket F 1207 Processor Socket F 1207 Processors Appendix D Streamline Plot of AMD Reference Custom 2U-4P System