AMD 1207 manual High Performance Heat Sink for Custom 2U-4P Systems

Thermal Design Guide for Socket F (1207) Processors 32800 Rev. 3.00 August 2006

the center to 2.5 mm at the edges. The heat sink also has three heat pipes soldered to the base and connected to the top of the fin stack to improve fin efficiency. This design provides optimum heat spreading performance from the processor to the heat sink. The fin geometry has been designed to provide optimized thermal performance in combination with the fans, as described in Section 5.3.5, on page 35, in a typical 2U-4P system.

Figure 10. High Performance Heat Sink for Custom 2U-4P Systems

Table 10 shows the parameters of the aluminum fins for the high-performance heat sink shown in Figure 10.

Table 10.	Fin Parameters
Length	Height (at Center)	Height (at Edges)	Thickness	Pitch	No of Fins
92 mm	32.5 mm	37 mm	0.2 mm	1.5 mm	39

Other fan and heat sink combinations may yield adequate thermal performance. The system designer must ensure that the thermal solution provides required cooling for the processor for the given system layout and flow characteristics.

Because the processor-mounting surface extends above the surface of the cam box on the socket, the heat sink bottom can be flat. The heat sink must have a flat surface of at least 40 mm x 40 mm, centered over the processor.

Figure 11 shows the measured thermal performance vs. flow rate for this heat sink. This data represents the expected performance of this heat sink on a dual-core socket F (1207) processor. Based

34 Thermal Design of Custom 2U-4P Systems Chapter 5