AMD 1207 manual List of Figures

32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors

List of Figures

Figure 1. The 1207-Pin Socket. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Figure 2. Motherboard Component Height Restrictions for Platforms Using the

AMD PIB Thermal Solution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on

Socket F (1207) Processors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18 Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems . . . . . . . . . .21 Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems . . . . . . . . . . . . . . . . .24 Figure 6. High Performance Heat Sink for Custom 1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . .25

Figure 7. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor

in 90 nm Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems. . . . . . . . . .29

Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F (1207) Processors32

Figure 10. High Performance Heat Sink for Custom 2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . .34

Figure 11. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor

in 90 nm Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 Figure 12. Socket F (1207) PIB Board Component Height Restrictions . . . . . . . . . . . . . . . . . . . . .38 Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone . . . . . . . .39 Figure 14. Socket F (1207) PIB Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . . . .40 Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone . . . . . . . . . . . . . . . . . . . . . . . .41 Figure 16. Socket F (1207) PIB Board No-Through-HoleKeep-Out . . . . . . . . . . . . . . . . . . . . . . .42 Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out. . . . . . . . . . . . . . . . . . . . . . . . . . . .43 Figure 18. Socket F (1207) 1U-2P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .46 Figure 19. Socket F (1207) 1U-2P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .47 Figure 20. Socket F (1207) 1U-2P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .48 Figure 21. Socket F (1207) 1U-2P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .49 Figure 22. Socket F (1207) 1U-2P Board No-Through-HoleKeep-Out . . . . . . . . . . . . . . . . . . . . .50 Figure 23. Socket F (1207) 1U-2P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Figure 24. Socket F (1207) 2U-4P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .54 Figure 25. Socket F (1207) 2U-4P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .55

List of Figures 5