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AMD 1207 manual Thermal Solution Design Requirements, Sample Heat Sinks and Attachment Methods

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4.2Thermal Solution Design Requirements

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

Depending on the system features and layout, more space around the socket may be available for the thermal solution than is shown in Figure 4 on page 21. This space permits heat sink designs with better thermal performance.

Appendix B on page 45 shows a complete, detailed set of keep-out drawings for custom 1U-2P systems based on socket F (1207) processors.

4.2Thermal Solution Design Requirements

To maintain the case temperature of the processor below the maximum specification, certain heat sink design parameters must be considered. Table 4 provides the design-target specifications that must be met for socket F (1207) processors to operate reliably.

Table 4.	Thermal Solution Design Requirements for Custom 1U-2P Systems

	Symbol	Description	Maximum

	L	Length of heat sink	87 mm

	W	Width of heat sink	74 mm

	H	Height of heat sink	28 mm

	θca	Case-to-ambient thermal	0.26°C/W1, 2, 3
		resistance
	MHS	Mass of heat sink	450 g to 700 g
	Fclip	Clip force	75 lbs ±15 lbs
	TA	Local air temperature entering	38°C
		processor heat sink

Notes:
1. This is the thermal resistance required for dual core, 90-nm socket F (1207) processors. The thermal resistance
requirement may vary depending on the product OPN. The user should consult the processor data sheet for the
thermal requirements specific to the part.
2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied
directly to the chassis for more reliable shock and vibration performance.
3. This chapter describes a heat sink weighing less than or equal to 450 g.

4.3Sample Heat Sinks and Attachment Methods

The following sections provide one possible thermal design solution and the specifics on attaching that solution to the motherboard.

Table 5 on page 23 lists the parts used in the thermal reference design solution for 1U-2P systems based on socket F (1207) processors.

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Thermal Design of Custom 1U-2P Systems

Chapter 4

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AMD 1207 manual Thermal Solution Design Requirements, Sample Heat Sinks and Attachment Methods

Contents

Advanced Micro Devices Issue DateThermal Design Guide for Socket F 1207 Processors Publication #2005 Advanced Micro Devices, Inc. All rights reserved TrademarksContents ContentsChapter 2 Processor Thermal Solutions Chapter 4 Thermal Design of Custom 1U-2P SystemsSocket F 1207 Processor Socket F 1207 ProcessorsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesList of Tables Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Date Revision HistoryRevision History RevisionRevision History Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Chapter Chapter 1 Introduction1.1 Summary of Requirements IntroductionThermal Design Guide for Socket F 1207 Processors IntroductionChapter Mechanical and Thermal Specifications for Socket F 1207 Processors Chapter 2 Processor Thermal Solutions2.1 Processor Specifications Processor Thermal SolutionsFigure 1. The 1207-Pin Socket 2.2 Socket DescriptionProcessor Thermal Solutions Thermal Design of Platforms Using the AMD Processor-In-a Chapter 3 Thermal Design of Platforms Usingthe AMD Processor-In-a-Box PIB Thermal Solution Box PIB Thermal Solution3.3 Sample Heat Sinks and Attachment Methods 3.2 Thermal Solution Design RequirementsThermal Design of Platforms Using the AMD Processor-In-a Part Description Thermal Design of Platforms Using the AMD Processor-In-aChapter Material3.3.1 Backplate Assembly Thermal Design of Platforms Using the AMD Processor-In-aThermal Design of Platforms Using the AMD Processor-In-a 3.3.2 Retention FrameChapter Thermal Design Guide for Socket F 1207 Processors Thermal Design of Platforms Using the AMD Processor-In-aBox PIB Thermal Solution ChapterThermal Design of Custom 1U-2P Systems Chapter 4 Thermal Design of Custom 1U-2P Systems4.1 Motherboard Component Height Restrictions Chapter4.3 Sample Heat Sinks and Attachment Methods 4.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems SystemsChapter Quantity4.3.2 Spring Screws 4.3.1 Backplate AssemblyFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems Thermal Design of Custom 1U-2P SystemsFin Parameters 4.3.3 Heat SinkFigure 6. High Performance Heat Sink for Custom 1U-2P Systems Chapter4.3.4 Fans Thermal Design of Custom 1U-2P SystemsChapter 4.3.5 Thermal Interface MaterialThermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 1U-2P SystemsChapter Thermal Design of Custom 2U-4P Systems Chapter 5 Thermal Design of Custom 2U-4P Systems5.1 Motherboard Component Height Restrictions Chapter5.3 Sample Heat Sinks and Attachment Methods 5.2 Thermal Solution Design RequirementsThermal Solution Design Requirements for Custom 2U-4P Systems Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems SystemsChapter QuantityThermal Design Guide for Socket F 1207 Processors 5.3.1 Backplate AssemblyThermal Design of Custom 2U-4P Systems Chapter5.3.4 Heat Sink 5.3.2 Spring Clip5.3.3 Retention Frame Chemical Element of SK7 Spring SteelThermal Design of Custom 2U-4P Systems Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsFin Parameters LengthChapter 5.3.5 Fans5.3.6 Thermal Interface Material Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 2U-4P SystemsChapter Appendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Thermal Design Guide for Socket F 1207 Processors Figure 12. Socket F 1207 PIB Board Component Height RestrictionsAppendix A A D V A N C E D M I C R O D E V I C E SThermal Design Guide for Socket F 1207 Processors Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneAppendix A 0.787Guide for Socket F 1207 Processors Socket F 1207 PIB Socket Outline and Socket WindowAppendix A Thermal DesignZone F 1207 PIBHeat Sink Height Appendix AF 1207 PIB Keep-OutAppendix A Thermal Design Guide for Socket F 1207 ProcessorsAppendix A Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutThermal Thermal Design GuideThermal Design Guide for Socket F 1207 Processors Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Appendix ASocket F 1207 Processor Appendix BKeep-Out Drawings for Custom 1U-2P Systems Based on the Height Restrictions Drawings for2P Systems Processor Appendix Bon the BasedHoles, Contact Pads, and No-Routing ZoneBased on the F 1207 ProcessorFigure 20. Socket F 1207 1U-2P Socket Outline and Socket WindowHeight Restriction Zone Figure 21. Socket F 1207 1U-2P Heat Sink1U-2P Systems 1207 Processor Appendix B2P Board No-Through-Hole Keep Keep-OutFigure 22. Socket F 1207 1U Drawings forDrawings for F 1207 1UAppendix B F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Appendix BSocket F 1207 Processor Appendix CKeep-Out Drawings for Custom 2U-4P Systems Based on the F 1207 Processor Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsDrawings for Appendix CKeep-Out 4P Mounting Holes, Contact Pads, and No-Routing ZoneAppendix C F 1207 ProcessorSocket Window Custom 2U-4PF 1207 2U-4P Socket Outline and Drawings forAppendix C Figure 27. Socket F 1207 2U-4P Heat Sink2U-4P Systems 1207 Processor Drawings forF 1207 Processor Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutDrawings for Appendix CDrawings for 1207Appendix C F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Socket F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Appendix CAppendix D Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemSocket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System Socket F 1207 Processors