Part Description Material Quantity | AMD 1207 specification

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Table 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for socket F (1207) processors.

Table 3. Components for the Processor Thermal Reference Design for the AMD PIB Thermal Solution

Part Description	Material	Quantity

Heat sink	Copper with aluminum fins	1

Heatpipe	Sintered-powder copper	2

Fan	Plastic	1

Spring clip	SK7 heat treated spring steel	1

Retention frame	Lexan, 20% glass-filled	2

Backplate	Low-carbon steel, anti-corrosive	1
	finish

Insulator	Formex GK-17	1

Figure 3 on page 18 shows an exploded view of the thermal solution for platforms using an AMD PIB based on socket F (1207) processors.

Chapter 3	Thermal Design of Platforms Using the AMD Processor-In-a-	17
	Box (PIB) Thermal Solution

Image 17

AMD 1207 manual Part Description Material Quantity

Contents

Thermal Design Guide for Socket F 1207 Processors Advanced Micro Devices, Inc. All rights reserved Contents Heat Sink Fans Thermal Interface Material List of Figures List of Figures List of Figures List of Tables List of Tables List of Tables Revision History Revision History Revision History Chapter Introduction Summary of Requirements Chapter Chapter Processor Thermal Solutions Processor Specifications 1207-Pin Socket Socket Description Motherboard Component Height Restrictions Sample Heat Sinks and Attachment Methods Thermal Solution Design Requirements Part Description Material Quantity Backplate Assembly Retention Frame Thermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Custom 1U-2P Systems Thermal Design of Custom 1U-2P Systems Symbol Systems Spring Screws Exploded View of Thermal Solution for Custom 1U-2P Systems Fin Parameters Heat Sink Fans Thermal Interface Material Thermal Design of Custom 1U-2P Systems Chapter Thermal Design of Custom 2U-4P Systems Thermal Design of Custom 2U-4P Systems Thermal Solution Design Requirements Heat sink Aluminum Fan Plastic Spring clip Backplate Assembly Chemical Element of SK7 Spring Steel Spring Clip High Performance Heat Sink for Custom 2U-4P Systems Fans Thermal Design of Custom 2U-4P Systems Appendix a Solution for Socket F 1207 Processors Socket F 1207 PIB Board Component Height Restrictions 64.36 76.41 49.91 59.81 787 724 000 784 520 189 Socket F 1207 PIB Socket Outline and Socket Window Zone 1207 PIB Heat Sink Height2x11.44 2x51.26 2x61.08 36.59 32.13 27.59 318 000 885 1207 PIBKeep-Out 10.09 33.91 49.91 Thermal233 Solution for Socket F 1207 Processors Socket F 1207 Processor Appendix B 1207 Drawings for2P Systems Processor Height Restrictions Holes, Contact Pads, BasedNo-Routing Zone 32.16 71.98 24.54 10.09 49.91 64.36 Window ProcessorBased on 42.71 82.53 32.16 71.98 1U-2P Systems 1207 ProcessorHeight Restriction Zone 2P Board No-Through-Hole Keep Keep-OutOut 598 000 166 40.59 80.41 233 335 965 1207 1U35.04 22.04 10.09 33.9 49.91 61.86 Socket F 1207 Processor Appendix C Socket F 1207 2U-4P Board Component Height Restrictions 47.40 87.22 35.65 4P Mounting Holes, Contact Pads, and No-Routing Zone24.54 64.36 75.47 Socket Window Custom 2U-4P1207 2U-4P Socket Outline 17.59 2U-4P Systems 1207 Processor260 681 266 40.59 80.41 Socket F 1207 2U-4P Board No-Through-Hole Keep-Out 166 80.41 1207 Socket F 1207 Processor Socket F 1207 Processors Appendix D Streamline Plot of AMD Reference Custom 2U-4P System