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AMD manual Appendix A, Solution for Socket F 1207 Processors

Models: 1207

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32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors

Appendix A contains detailed recommended keep-out drawings for processor heat sink and mounting hardware for platforms using socket F (1207) Processor-In-a-Box (PIB) processors. Depending on the system features and layout, more space around the processor may be available for the thermal solution than is shown in these drawings. This space permits the design of heat sinks with better thermal performance.

Appendix A	Keep-Out Drawings for Platforms Using the PIB Thermal	37
	Solution for Socket F (1207) Processors

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AMD manual Appendix A, Solution for Socket F 1207 Processors, Keep-Out Drawings for Platforms Using the PIB Thermal

Contents

Thermal Design Guide for Socket F 1207 Processors Issue DateAdvanced Micro Devices Publication #Trademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 2 Processor Thermal Solutions ContentsContents Chapter 4 Thermal Design of Custom 1U-2P SystemsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorsSocket F 1207 Processor Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of TablesList of Tables Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August Revision History Revision HistoryDate RevisionRevision History Thermal Design Guide for Socket F 1207 Processors32800 Rev. 3.02 August 1.1 Summary of Requirements Chapter 1 IntroductionChapter IntroductionThermal Design Guide for Socket F 1207 Processors IntroductionChapter 2.1 Processor Specifications Chapter 2 Processor Thermal SolutionsMechanical and Thermal Specifications for Socket F 1207 Processors Processor Thermal SolutionsFigure 1. The 1207-Pin Socket 2.2 Socket DescriptionProcessor Thermal Solutions the AMD Processor-In-a-Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms UsingThermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal Solution3.3 Sample Heat Sinks and Attachment Methods 3.2 Thermal Solution Design RequirementsThermal Design of Platforms Using the AMD Processor-In-a Chapter Thermal Design of Platforms Using the AMD Processor-In-aPart Description MaterialThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate AssemblyThermal Design of Platforms Using the AMD Processor-In-a 3.3.2 Retention FrameChapter Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-aThermal Design Guide for Socket F 1207 Processors Chapter4.1 Motherboard Component Height Restrictions Chapter 4 Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems ChapterThermal Solution Design Requirements for Custom 1U-2P Systems 4.2 Thermal Solution Design Requirements4.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 1U-2P SystemsChapter SystemsThermal Design of Custom 1U-2P Systems QuantityFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.1 Backplate Assembly4.3.2 Spring Screws Thermal Design of Custom 1U-2P SystemsFigure 6. High Performance Heat Sink for Custom 1U-2P Systems 4.3.3 Heat SinkFin Parameters ChapterThermal Design of Custom 1U-2P Systems 4.3.4 FansChapter 4.3.5 Thermal Interface MaterialThermal Design of Custom 1U-2P Systems Thermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 1U-2P SystemsChapter 5.1 Motherboard Component Height Restrictions Chapter 5 Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems ChapterThermal Solution Design Requirements for Custom 2U-4P Systems 5.2 Thermal Solution Design Requirements5.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 2U-4P SystemsChapter SystemsThermal Design of Custom 2U-4P Systems QuantityThermal Design of Custom 2U-4P Systems 5.3.1 Backplate AssemblyThermal Design Guide for Socket F 1207 Processors Chapter5.3.3 Retention Frame 5.3.2 Spring Clip5.3.4 Heat Sink Chemical Element of SK7 Spring SteelFin Parameters Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems Length5.3.6 Thermal Interface Material 5.3.5 FansChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Thermal Design of Custom 2U-4P SystemsChapter Appendix A Solution for Socket F 1207 ProcessorsKeep-Out Drawings for Platforms Using the PIB Thermal Appendix A Figure 12. Socket F 1207 PIB Board Component Height RestrictionsThermal Design Guide for Socket F 1207 Processors A D V A N C E D M I C R O D E V I C E SAppendix A Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneThermal Design Guide for Socket F 1207 Processors 0.787Appendix A Socket F 1207 PIB Socket Outline and Socket WindowGuide for Socket F 1207 Processors Thermal DesignHeat Sink Height F 1207 PIBZone Appendix AAppendix A Keep-OutF 1207 PIB Thermal Design Guide for Socket F 1207 ProcessorsThermal Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutAppendix A Thermal Design GuideKeep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsThermal Design Guide for Socket F 1207 Processors Appendix ASocket F 1207 Processor Appendix BKeep-Out Drawings for Custom 1U-2P Systems Based on the 2P Systems Processor Drawings forHeight Restrictions Appendix BHoles, Contact Pads, and Basedon the No-Routing ZoneFigure 20. Socket F 1207 1U-2P Socket Outline and Socket F 1207 ProcessorBased on the Window1U-2P Systems 1207 Processor Figure 21. Socket F 1207 1U-2P Heat SinkHeight Restriction Zone Appendix BFigure 22. Socket F 1207 1U Keep-Out2P Board No-Through-Hole Keep Drawings forAppendix B F 1207 1UDrawings for F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Socket F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor Appendix CKeep-Out Drawings for Custom 2U-4P Systems Based on the Drawings for Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsF 1207 Processor Appendix CAppendix C 4P Mounting Holes, Contact Pads, and No-Routing ZoneKeep-Out F 1207 ProcessorF 1207 2U-4P Socket Outline and Custom 2U-4PSocket Window Drawings for2U-4P Systems 1207 Processor Figure 27. Socket F 1207 2U-4P Heat SinkAppendix C Drawings forDrawings for Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutF 1207 Processor Appendix CAppendix C 1207Drawings for F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Socket F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CAppendix D Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemSocket F 1207 Processors Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System