AMD manual Appendix a, Solution for Socket F 1207 Processors

32800 Rev. 3.00 August 2006 Thermal Design Guide for Socket F (1207) Processors

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors

Appendix A contains detailed recommended keep-out drawings for processor heat sink and mounting hardware for platforms using socket F (1207) Processor-In-a-Box (PIB) processors. Depending on the system features and layout, more space around the processor may be available for the thermal solution than is shown in these drawings. This space permits the design of heat sinks with better thermal performance.

Appendix A	Keep-Out Drawings for Platforms Using the PIB Thermal	37
	Solution for Socket F (1207) Processors