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AMD F 1207 PIB, Heat Sink Height, Zone, Appendix A, Socket, 2x11.44, 2x51.26, 2x61.08, 36.59

Models: 1207

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Socket

Appendix A

Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F (1207) Processors

41

Figure 15.	8	7
Socket	H e a t S i n k H e i g h t R e s t r i c t i o n Z o n e
	H e a t S i n k H e i g h t R e s t r i c t i o n Z o n e
F (1207) PIB	D
F (1207) PIB
Heat Sink Height	C
Heat Sink Height
Restriction	B	2x11.44	2x51.26	2x61.08
Zone		36.59	32.13	27.59
	A
	3 . 3 0 [ 0 . 1 3 0 ' ' ] M a x c o m p o n e n t h e i g h t .
	8 . 0 0 [ 0 . 3 1 5 ' ' ] M a x c o m p o n e n t h e i g h t .
	8	7

6

5

4

3

2

1

D

			5 7 . 7 4	2 . 2 7 3	2 x
			5 0 . 1 4	1 . 9 7 4	2 x
			2 8 . 1 4	1 . 1 0 8	2 x
								C
P i n	A 1		8 . 6 0	0 . 3 3 9	2 x
			8 . 6 0	0 . 3 3 9	2 x
			0 . 0 0	0 . 0 0 0
			1 3 . 4 0	0 . 5 2 8	2 x
			2 1 . 0 0	0 . 8 2 7	2 x
								B
	2x 2x 2x
0.000	2.65 4	2.833	3.00 8
0.00
	67.41	71.95	76.41
							A D V A N C E D M I C R O D E V I C E S
						T IT L E :	A U S T I N , T E X A S
						T IT L E :
						S o c k e t F ( 1 2 0 7 ) P r o c e s s o r C o m p o n e n t		A
						K e e p o u t a n d H e i g h t R e s t r i c t i o n s C o m p l i a n t
						w i t h A M	D P I B
						D W G .	N O .	R E V
						7 9 Z 0 0 0 0 1 2 4		2 . 1
							S H E E T 4	O F 6
6	5		4		3	2	1

32800 Rev. 3.00 August 2006

Thermal Design Guide for Socket F (1207) Processors

Image 41

AMD F 1207 PIB, Heat Sink Height, Zone, Appendix A, Thermal Design Guide for Socket F 1207 Processors, 2x11.44, 2x51.26

Contents

Thermal Design Guide for Socket F 1207 Processors Issue DateAdvanced Micro Devices Publication #Trademarks 2005 Advanced Micro Devices, Inc. All rights reservedChapter 2 Processor Thermal Solutions ContentsContents Chapter 4 Thermal Design of Custom 1U-2P SystemsAppendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the Socket F 1207 ProcessorsSocket F 1207 Processor Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on theList of Figures List of FiguresFigure 26. Socket F 1207 2U-4P Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . .56 Figure 27. Socket F 1207 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57 Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58 Figure 29. Socket F 1207 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61 Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System List of Tables List of Tables32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsList of Tables Revision History Revision HistoryDate Revision32800 Rev. 3.02 August Thermal Design Guide for Socket F 1207 ProcessorsRevision History 1.1 Summary of Requirements Chapter 1 IntroductionChapter IntroductionChapter IntroductionThermal Design Guide for Socket F 1207 Processors 2.1 Processor Specifications Chapter 2 Processor Thermal SolutionsMechanical and Thermal Specifications for Socket F 1207 Processors Processor Thermal SolutionsProcessor Thermal Solutions 2.2 Socket DescriptionFigure 1. The 1207-Pin Socket the AMD Processor-In-a-Box PIB Thermal Solution Chapter 3 Thermal Design of Platforms UsingThermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal SolutionThermal Design of Platforms Using the AMD Processor-In-a 3.2 Thermal Solution Design Requirements3.3 Sample Heat Sinks and Attachment Methods Chapter Thermal Design of Platforms Using the AMD Processor-In-aPart Description MaterialThermal Design of Platforms Using the AMD Processor-In-a 3.3.1 Backplate AssemblyChapter 3.3.2 Retention FrameThermal Design of Platforms Using the AMD Processor-In-a Box PIB Thermal Solution Thermal Design of Platforms Using the AMD Processor-In-aThermal Design Guide for Socket F 1207 Processors Chapter4.1 Motherboard Component Height Restrictions Chapter 4 Thermal Design of Custom 1U-2P SystemsThermal Design of Custom 1U-2P Systems ChapterThermal Solution Design Requirements for Custom 1U-2P Systems 4.2 Thermal Solution Design Requirements4.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 1U-2P SystemsChapter SystemsThermal Design of Custom 1U-2P Systems QuantityFigure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems 4.3.1 Backplate Assembly4.3.2 Spring Screws Thermal Design of Custom 1U-2P SystemsFigure 6. High Performance Heat Sink for Custom 1U-2P Systems 4.3.3 Heat SinkFin Parameters ChapterThermal Design of Custom 1U-2P Systems 4.3.4 FansThermal Design of Custom 1U-2P Systems 4.3.5 Thermal Interface MaterialChapter Chapter Thermal Design of Custom 1U-2P SystemsThermal Design Guide for Socket F 1207 Processors 5.1 Motherboard Component Height Restrictions Chapter 5 Thermal Design of Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems ChapterThermal Solution Design Requirements for Custom 2U-4P Systems 5.2 Thermal Solution Design Requirements5.3 Sample Heat Sinks and Attachment Methods Thermal Design of Custom 2U-4P SystemsChapter SystemsThermal Design of Custom 2U-4P Systems QuantityThermal Design of Custom 2U-4P Systems 5.3.1 Backplate AssemblyThermal Design Guide for Socket F 1207 Processors Chapter5.3.3 Retention Frame 5.3.2 Spring Clip5.3.4 Heat Sink Chemical Element of SK7 Spring SteelFin Parameters Figure 10. High Performance Heat Sink for Custom 2U-4P SystemsThermal Design of Custom 2U-4P Systems Length5.3.6 Thermal Interface Material 5.3.5 FansChapter Thermal Design of Custom 2U-4P SystemsChapter Thermal Design of Custom 2U-4P SystemsThermal Design Guide for Socket F 1207 Processors Keep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsAppendix A Appendix A Figure 12. Socket F 1207 PIB Board Component Height RestrictionsThermal Design Guide for Socket F 1207 Processors A D V A N C E D M I C R O D E V I C E SAppendix A Socket F 1207 PIB Mounting Holes, Contact Pads, and No-Routing ZoneThermal Design Guide for Socket F 1207 Processors 0.787Appendix A Socket F 1207 PIB Socket Outline and Socket WindowGuide for Socket F 1207 Processors Thermal DesignHeat Sink Height F 1207 PIBZone Appendix AAppendix A Keep-OutF 1207 PIB Thermal Design Guide for Socket F 1207 ProcessorsThermal Figure 17. Socket F 1207 PIB Board Bottom Side Keep-OutAppendix A Thermal Design GuideKeep-Out Drawings for Platforms Using the PIB Thermal Solution for Socket F 1207 ProcessorsThermal Design Guide for Socket F 1207 Processors Appendix AKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BSocket F 1207 Processor 2P Systems Processor Drawings forHeight Restrictions Appendix BHoles, Contact Pads, and Basedon the No-Routing ZoneFigure 20. Socket F 1207 1U-2P Socket Outline and Socket F 1207 ProcessorBased on the Window1U-2P Systems 1207 Processor Figure 21. Socket F 1207 1U-2P Heat SinkHeight Restriction Zone Appendix BFigure 22. Socket F 1207 1U Keep-Out2P Board No-Through-Hole Keep Drawings forAppendix B F 1207 1UDrawings for F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Socket F 1207 ProcessorKeep-Out Drawings for Custom 1U-2P Systems Based on the Appendix BKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CSocket F 1207 Processor Drawings for Figure 24. Socket F 1207 2U-4P Board Component Height RestrictionsF 1207 Processor Appendix CAppendix C 4P Mounting Holes, Contact Pads, and No-Routing ZoneKeep-Out F 1207 ProcessorF 1207 2U-4P Socket Outline and Custom 2U-4PSocket Window Drawings for2U-4P Systems 1207 Processor Figure 27. Socket F 1207 2U-4P Heat SinkAppendix C Drawings forDrawings for Figure 28. Socket F 1207 2U-4P Board No-Through-Hole Keep-OutF 1207 Processor Appendix CAppendix C 1207Drawings for F 1207 ProcessorThermal Design Guide for Socket F 1207 Processors Socket F 1207 ProcessorKeep-Out Drawings for Custom 2U-4P Systems Based on the Appendix CSocket F 1207 Processors Figure 30. Floor-Plan of AMD Reference Custom 2U-4P SystemAppendix D Socket F 1207 Processors Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System