Hitachi GR2000 manual Hardware Installation, Xlvi

GR2000 Installation Guide

Half-Size NIF Installation Examples	4-18
Example of No. of multicast group	4-25
MPLS Backbone and Access Circuits	4-28
Clock closed-loop prohibition	4-56
Conversion from Ethernet Frame to ATM Cells	4-58
Shaping at Overload	4-59
Next_Hop resolution	4-66
Network Configuration Requiring noinstall for aggregate Definition	4-67
Example for Specifying a nexthopself Parameter	4-69

Configuration to use the device for communication between IPv6 terminals on the same link ... 4-70

Configuration to become object of ICMPv6 re-direct message transmission	4-70
Typical Frame Relay Network with Bridge Connection	4-77
BPDU Frame Format Supported	4-77
Normal QoS Operation	4-79
Failing QoS Operation with Heavy Load on RP	4-80
Failing QoS on ATM Interface (Transmitting Inbound-QoS-Defined Packets onto
ATM Interface)	4-80
Network Configuration	4-82
Network patterns applicable to PIM-DM and PIM-SM	4-85
Inapplicable network pattern in PIM-DM	4-86
Applicable PIM-SM network pattern	4-87

Chapter 5 - Installation Site Conditions	5-1
Process of Falling-Dust Measurement	5-2
Main Power Line Examples	5-3
Standard (Non-Redundant) Power Feeding with 100V ac Input	5-7
Redundant Power Feeding with 100V ac Input	5-7
Standard (Non-Redundant) Power Feeding with 200V ac Input	5-8
Redundant Power Feeding with 200V ac Input	5-8
Standard (Non-Redundant) Power Feeding with –48V or –60V dc Input	5-9
Redundant Power Feeding with –48V or –60V dc Input	5-9
Airflow of GR2000-2S	5-13
Airflow of GR2000-10H	5-14
Airflow of GR2000-20H	5-14
Airflow of GR2000-4	5-15
Airflow of GR2000-10	5-15
Airflow of GR2000-20	5-16

Chapter 6 - Hardware Installation	6-1
Unpacking of GR2000-2S	6-1
Unpacking of GR2000-4S	6-2
Unpacking of GR2000-6H	6-3
Unpacking of GR2000-10H	6-4
Unpacking of GR2000-20H	6-5
Unpacking of GR2000-4	6-6
Unpacking of GR2000-10	6-7
Unpacking of GR2000-20	6-8
Unpacking of Separately Shipped RM/RP/NIF Full Size Board	6-9
Unpacking of Separately Shipped NIF Half Size Board	6-9
Unpacking of Separately Shipped Memory Module	6-10
Unpacking of Flash Memory Card (MC)	6-10
Unpacking of Separately Shipped Cable	6-11
Sample Handling of Module on Anti-Static Surface	6-11
xlvi	GR2K-GA-1002
	Rev. 6.03