Integrator’s Reference Manual

Modem Dimensions and Weight

Modem dimensions are 190 x 75 x 17 millimeters (7.48 x 2.95 x 0.68 inches).

Modem weight is less than 180 grams (6.3 ounces).

Modem Antenna Connectors

Caution

Caution

The GSP-1620 modem has two (2) MCX snap-in connectors for the antenna leads, connecting the DRA antenna to the modem:

Transmit (Tx) lead is labeled J3.

Receive (Rx) lead is labeled J7.

When you connect antenna cables, be careful to connect the Tx connector on the antenna to the Tx connector (J3) on the modem, and the Rx connector on the antenna to the Rx connector (J7) on the modem. Crossing the Tx and Rx cables can damage the modem.

The MCX connectors are secured only by a solder joint and are not designed to withstand excessive force. When cables are connected to these connectors, care must be taken to ensure adequate strain relief is provided.

Data and Control Ports

The Data and Control ports are combined into a single DB-25 male upright connector, which provides the primary user interface:

The connector contains two (2) 9-pin serial ports, DC power leads, and a reset lead.

Line speed for the Data port is variable between 300 bps and 115.2 kbps. (This is different from the over-the-air Data port rate, which is 9600 bps.)

Line speed for the Control port is fixed at 9600 bps.

Signaling uses 8 bits, no parity and 1 stop bit (8,N,1).

All ports are ESD and short-circuit protected.

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Qualcomm GSP-1620 specifications Modem Antenna Connectors, Data and Control Ports, Modem Dimensions and Weight

GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.