Integrating GSP-1620 Modems into OEM Products

DC Power

Warning

Caution

The GSP-1620 modem requires input DC power ranging from

5.6V to 16 V, with 1 Amp (maximum). The modem DC input power must be clean (maximum of 50 mV peak-peak ripple and noise) and must be within the absolute maximum voltage range of 5.6 V to 16 V under all conditions. For typical DC power consumption limits, see Power Consumption on page 7-16.

The GSP-1620 modem uses a DC/DC converter to source its internal operating voltages and behaves like a constant power load over varying input voltages that has a varying input impedance when the modem is transmitting data. This creates a potential for oscillations on the DC power line if the input impedance of the modem is lower than that of the power supply sourcing the power.

The approximate minimum input impedance of the modem is

given by R = V2/Pmax where V is the operating voltage of the modem and Pmax is the maximum power consumed by the modem. For example, the minimum input impedance of the

modem at 12V would be approximately 12*12/5.4 = 26.7 Ohms. Any DC power supply capable of supplying the peak demand of 5.4W at 12V would have this output impedance. Additional design margin of at least 20% is recommended beyond this minimum value.

Care should be taken that if additional EMI filtering is added (see EMI Filtering on page 7-16), the impedance as seen by the modem’s input power supply does not exceed this value.

Do not unplug the power cables while the modem is powered up. This can cause ESD damage to the modem and also presents a danger of electrical shock.

You must ensure that the output impedance of the power supply sourcing DC power to the modem is always less than that of the input impedance of the modem. Otherwise, a potential exists for oscillations on the DC power line and the GSP-1620 modem will not operate as designed.

80-99208-1 Rev. D

7-15

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Qualcomm GSP-1620 specifications DC Power
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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