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Qualcomm specifications Table E-1. Specification Summary GSP-1620 Modem

Models: GSP-1620

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E SPECIFICATION SUMMARY

This appendix summarizes the specifications for the QUALCOMM Globalstar GSP-1620 Satellite Data Modem and its Dielectric Resonator Antenna (DRA).

For further discussion of hardware issues, see Chapter 7,

Integrating GSP-1620 Modems into OEM Products.

Table E-1. Specification Summary — GSP-1620 Modem

Operating Frequencies

Transmit:

1610-1625 MHz

 

 

Receive:

2484-2499 MHz

 

 

 

 

 

Maximum Transmit Power

+26 dBm EIRP (0.4 W)

 

 

 

 

 

 

 

DC Input Voltage

+5.6 V to + 16 V

 

 

 

 

 

 

 

 

Power Consumption Estimates @ 12V Input

State

Min

Typical

Max

 

Shutdown

1.2 mW

2.4 mW

6 mW

 

Standby

280 mW

500 mW

2.4 W

 

Transmit

3.6 W

4.8 W

5.4 W

 

 

 

 

 

Interfaces:

 

 

 

 

User Port

DB25 Serial RS-232 with pin-outs for data, control,

Modem Antenna Connectors

and power

 

 

 

TX MCX Female

 

 

 

 

 

 

 

Antenna Connectors

RX MCX Female

 

 

 

TX SMA Female

 

 

 

 

 

 

 

 

RX SMA Female

 

 

 

 

 

 

 

 

Provisioning and Software Upgrade

DE9 Connector

 

 

 

 

 

 

Modem Dimensions

190 x 75 x 17 mm (7.48 x 2.95 x 0.68 in)

 

 

 

 

 

Modem Weight

Less than 180 grams (6.3 ounces)

 

 

 

 

Antenna (included)

103 mm (4.1 in) diameter by 63 mm (2.5 in) tall

 

Estimated weight is less than 250 grams (8.8 ounces)

 

 

 

 

 

80-99208-1 Rev. D

E-1

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Qualcomm specifications Table E-1. Specification Summary GSP-1620 Modem
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.