Integrator’s Reference Manual

•ICNIRP (1996) [International Commission on Non-Ionizing Radiation Protection]

•IRPA (1991) [International Radiation Protection Association]

The GSP-1620 modem is designed to comply with the established ANSI, FCC, and international safety standards for safe levels of human exposure to RF energy. Maintaining

aminimum line-of-sight separation distance of 21.5 centimeters (8.5 inches) between the transmitting antenna and all personnel will ensure that the General Population/Uncontrolled Exposure maximum permissible exposure (MPE) limits are not exceeded.

This satisfies the MPE limits mandated by the FCC in 47 CFR Ch. 1 (10-1-99 Edition), Part 1, §1.1310 and defined in the ANSI/IEEE C95.1-1992 standard, and also satisfies the more-stringent European and international exposure limit recommendations of IRPA (1991) and ICNIRP (1996).

Caution

The ODU antenna must be installed in a configuration that ensures a

minimum line-of-sight separation distance of 21.5 centimeters (8.5

 

 

inches) is maintained at all times between the ODU antenna and any

 

personnel.

Electronic Device Restrictions

Most modern electronic equipment is shielded from RF signals. However, certain electronic equipment may not be shielded against the RF signals from wireless phones and modems.

Pacemakers

The Health Industry Manufacturers Association recommends that a minimum separation distance of 15.24 centimeters (6 inches) be maintained between a handheld wireless phone and a pacemaker to avoid potential interference with the pacemaker.

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80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications Electronic Device Restrictions, Pacemakers
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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