Integrating GSP-1620 Modems into OEM Products

Instead, you should fill the groove on the antenna, which is normally used for the O-ring, with an adhesive caulking material that can bond to the aluminum antenna base and the surface to which you are mounting the antenna. The caulk seals out moisture and dirt.

Tip For extra protection on either flat or rough surface mounts, you can coat the antenna’s SMA connectors before sealing the antenna base; for details, see Mounting and Sealing Antennas on Poles.

Mounting and Sealing Antennas on Poles

Instead of mounting the modem antenna (DRA) on a flat surface or bulkhead, you can mount it on a pole with six M4 screws. A pole mount may be desirable in snowy locations, to prevent wet ice or snow from building up to more than the maximum allowable thickness of 20 centimeters (8 inches).

In a pole mounting, the antenna’s SMA connectors, which are not self-sealing, are exposed to weather and precipitation. Therefore, you should seal the SMA connectors with a commercially available coating for outdoor cable or electrical connectors. For example, you could use a product such as “Liquid Electrical Tape” from PDI Inc., which is weather and corrosion resistant.

Mounting Multiple Antennas

If required for your application, you can mount multiple antennas within several feet of each other without creating significant interference.

QUALCOMM testing has determined that if two antennas are placed near each other and transmit on different frequencies, only a barely perceptible (1 dB or less) increase in 1605 emission occurs when tested at full jamming power. This maps to isolation between antennas of 20 dB. Even for antennas whose bases were touching (zero inches separation) the isolation was 22 dB in the worst case of rotation with respect to one another.

80-99208-1 Rev. D

7-29

Page 207 Page 209
Page 208
Image 208
Qualcomm GSP-1620 specifications Mounting and Sealing Antennas on Poles, Mounting Multiple Antennas
Page 207 Page 209

GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
Top Page Image Contents