AT Command Reference

Note

As shown in the syntax above, any of the parameters can be optionally

specified. Any unspecified value is left unchanged. Optional parameters

 

 

must be separated by commas. The commas act as place holders (in

 

the command parser) for the missing optional parameters.

 

<tcpmod>

Defines whether or not to use the default

 

 

TCP values, or to use the values passed in.

 

<lowertxmss>

Sets the lower bound for outgoing TCP

 

 

packet sizes.

 

<uppertxmss>

Sets the upper bound for outgoing TCP

 

 

packet sizes. The variable can be

 

 

overwritten during TCP negotiation if the

 

 

other end of the connection sets a TCP MSS

 

 

lower than this value.

 

<rxmss>

Sets the size for the incoming TCP MSS.

 

<minrto>

Sets the minimum value for the range used

 

 

to calculate the retransmit timeout.

 

<maxrto>

Sets the maximum value for the range used

 

 

to calculate the retransmit timeout.

 

<minato>

Set the minimum value for the range used

 

 

to calculate the acknowledgment timeout.

 

<maxato>

Sets the maximum values for the range

 

 

used to calculate the acknowledgment

 

 

timeout.

 

<tcpmaxbackoff>

Sets the number of TCP backoffs allowed

 

 

before tearing down the connection. A value

 

 

of zero will keep the phone from tearing

 

 

down the call based on the number of TCP

 

 

backoffs.

If <tcpmod> is equal to one, the values in the rest of the variables are put into effect. If <tcpmod> is set to zero, the rest of the values entered into the AT command are ignored, and the default values are restored to the internal variables.

Valid Value(s) <tcpmod>

0Use the default values for the TCP stack.

1Use the values passed in for the TCP stack.

<lowertxmss>

0-1500Lower bound for the transmit MSS

80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications Command parser for the missing optional parameters, Valid Values tcpmod
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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