Modem Mounting Guidelines

Integrating GSP-1620 Modems into OEM Products

shielded cable configuration in order to demonstrate compliance with the requirements.

Your OEM application may need different grounding configurations. The options are as follows:

• Option 1 — A chassis ground connection to the modem may be established using conductive support posts/ screws between the modem mounting holes, where the solder mask is exposed on both sides of the board, and the OEM-provided chassis (metallic enclosure or base).

• Option 2 — DNI (do not install) resistors (R216 and R217) on the modem circuit card allow for the option of connecting digital ground and chassis ground together.

• Option 3 — The user interface DB-25 cable shield termination is provided through Pin 1 of the DB-25 connector. The cable shield drain wire may be connected to this pin to provide a termination of the cable shield to either chassis or digital ground (options 1 & 2 dependency).

	Caution	The RF connector ground is the same as the signal and power ground.
	Caution	As an OEM, you should understand this when designing an integrated

		product for use in environments where surge protection may be
		required. You should also be aware of this fact to avoid ground loops in
		the final installation.

QUALCOMM offers the GSP-1620 modem without a mechanical enclosure, anticipating that OEMs will integrate and package the modem into an enclosure or cabinet appropriate to the end-user’s application. The enclosure must shield the GSP-1620 modem from direct impacts, precipitation, vibration, acoustic noise, and particulates.

The GSP-1620 modem has six mounting holes sized for M3 screws. All six mounting locations of the modem must be fastened to a rigid structure to meet the vibration and shock requirements specified in Integrating Modems into Products on page 7-2.

80-99208-1 Rev. D

7-19

GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.

Qualcomm GSP-1620 specifications Modem Mounting Guidelines

Models: GSP-1620

Integrating GSP-1620 Modems into OEM Products