Integrator’s Reference Manual

Pause Before Blind Dialing Time 6-27pauses, during dialing 6-29periodic application 5-6

Perl 5-2

phone book entries 6-21pinouts

Diagnostic port 7-13interface connector 7-9

pipe, for data 5-19pipelines 5-6

PLS, see Position Location Service polarization, antenna E-3pole-mounting antennas 7-29ports

activation changes during operation 5-15

active 5-9, 5-13

affected by AT commands 5-13,5-14

arbitration

5-9

 

behavior

5-10

 

configuration 5-8,5-9

 

configuration and SMS

5-17

during power on and off

5-16

see also Control port, Data port,

Diagnostic port

 

using Data and Control

5-7

POS 1 DTR to GND 2-7,3-3,7-12

POS 2 DTR Open

2-7, 7-12

POS 3 Not Used

2-7, 7-12, 7-13

Position Location

 

 

Determination

5-21

Service 6-66

 

 

POWER 7-14

 

 

power

 

 

consumption

7-16, E-1

DC requirements

7-15

ground 7-19

 

 

handling, antenna

E-3

maximum transmit E-1modes 7-17

on/off 7-7,7-17,7-18port use during 5-16

requirements 2-12powering modem

off 2-18

with AC adapter 2-13

with DC power supply

2-14

PPP

 

 

session

5-22

 

with asychronous data

5-34

precipitation

7-3, 7-19

 

Preferred Service Provider

3-6

printing SMS message 6-52

product support D-1

 

PROGRAM

7-14

 

protocol stacks 5-22

 

PROVIDER

4-2, 6-63

 

provisioning

3-1, E-1

 

PSTN 1-2, 5-3, 5-4, 6-42, 6-45

Public Switched Telephone Network, see

PSTN

pulse dialing 6-11

Q

QUALCOMM

defaults for modem 6-17mark on enclosures 7-20

R

R&TTE Directive B-2R216, R217 7-19

Radio Astronomy exclusion zones B-3reboot 7-9

receive section, antenna 7-22

Received Line Signal Detector, see RLSD received signal strength 4-3

Index-12

80-99208-1 Rev. D

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Image 257
Qualcomm GSP-1620 specifications Active 5-9, 7-12, 16, E-1, E-1 Pstn 1-2, 5-3, 5-4, 6-42, Index-12

GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.