Getting Started

What You May Need in Addition to the Kit

The Modem Integrator’s Kit should be sufficient for setting up one modem on a bench for development and testing.

For GSP-1620 modem development purposes (bench setup and developing modem applications), it is recommended that you have a Windows PC, because the Modem Integrator’s Kit CD-ROM contains some Windows code samples.

If necessary, you can power the modem via the AC adapter on the Diagnostic cable, but you may prefer to use your own DC power supply. Mounting a bench modem and antenna is optional, but would require M3 and M4 screws, respectively, and a screwdriver.

OEMs who are packaging modems into end-user products will need to supply mounting enclosures and customized cables. For details, see Integrating GSP-1620 Modems into OEM Products on page 7-1.

Configuration and setup of computer systems to use the GSP-1620 modem with Point-to-Point Protocol (PPP) is beyond the scope of this document. However, the configuration procedures for the QUALCOMM Globalstar GSP-1600 Tri-Mode Phone are included as a reference in the QUALCOMM Globalstar Data User Guide, 80-99126-1 (located on the kit’s CD-ROM). For example, using the procedures in that document, you can set up a Windows modem driver and Windows Dial-Up Networking. With the proper DNS addresses from your Service Provider (SP) or Internet Service Provider (ISP), you can access the Internet using your GSP-1620 modem via the Globalstar satellite system.

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Qualcomm GSP-1620 specifications What You May Need in Addition to the Kit

GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.