Integrator’s Reference Manual

Table 7-1. Interface Connector Pinouts

Pin

Signal Name

Signal

Direction

Description

Number

 

Level

User <-> Modem

 

 

 

 

 

 

1

Chassis

-

Chassis Ground

Isolated chassis ground

 

Ground

 

 

 

 

 

 

 

 

2

DP_TXD

RS-232

DTE -> DCE

Data port TXD

 

 

 

 

 

3

DP_RXD

RS-232

DTE <- DCE

Data port RXD

 

 

 

 

 

4

DP_RTS

RS-232

DTE -> DCE

Data port RTS

 

 

 

 

 

5

DP_CTS

RS-232

DTE <- DCE

Data port CTS

 

 

 

 

 

6

DP_DSR

RS-232

DTE <- DCE

This pin is the DSR for the

 

 

 

 

Data port and is asserted

 

 

 

 

when the modem detects

 

 

 

 

activity on the Data port

 

 

 

 

and is ready to

 

 

 

 

communicate with the

 

 

 

 

DTE over this port. This

 

 

 

 

signal is de-asserted when

 

 

 

 

the modem detects no

 

 

 

 

activity on the Data port;

 

 

 

 

or is de-asserted as an

 

 

 

 

acknowledgment to the

 

 

 

 

user, indicating that the

 

 

 

 

modem has completed its

 

 

 

 

power- down sequence

 

 

 

 

after the DTR lines of all

 

 

 

 

serial ports have

 

 

 

 

de-asserted.

 

 

 

 

 

7

Ground

Ground

Ground return

Ground return

 

 

 

 

 

8

DP_DCD

RS-232

DTE <- DCE

Data port DCD

 

 

 

 

 

9

DC_POWER

5.6V-16V

 

Modem power

 

 

 

 

10

DC_POWER 5.6V-16V

 

Modem power

 

 

 

 

 

11

Ground

Ground

Ground return

Ground return

 

 

 

 

 

12

CP_DTR

RS-232

DTE -> DCE

Control port DTR

 

 

 

 

 

13

Reserved

Reserved

Reserved

 

 

 

 

 

 

14

CP_TXD

RS-232

DTE -> DCE

Control port TXD

 

 

 

 

 

7-10

80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications Integrator’s Reference Manual Interface Connector Pinouts
Page 188 Page 190

GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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