Integrator’s Reference Manual

How This Manual Is Organized

This following table summarizes how information is organized in this manual.

Chapter

Description

 

 

Chapter 1. Getting Started

Introduction to the GSP-1620 modem and

 

the Modem Integrator’s Kit.

 

 

Chapter 2.

Quick instructions for connecting and

Quick Bench Set-Up

powering up the modem and sending

 

commands via HyperTerminal.

 

 

Chapter 3.

Coordinating with Service Providers and

Service-Programming Modems

re-programming default modem

 

parameters.

 

 

Chapter 4.

Quick tutorial on setting up a PC for

Making Simple Data Calls

packet data, making mobile-originated

 

packet data calls, and using modem ports.

 

 

Chapter 5.

Developing software applications that

Developing Modem Applications

work with modem features.

 

 

Chapter 6.

Developer’s reference for AT commands,

AT Command Reference

syntax, and values.

 

 

Chapter 7.

Hardware descriptions of the modem and

Integrating GSP-1620 Modems

antenna, mounting guidelines, and

into OEM Products

environmental specifications.

 

 

Chapter 8. Troubleshooting

Suggested solutions for modem problems.

 

 

Appendix A.

Globalstar space and ground segments,

Globalstar Background

coverage and carriers.

 

 

Appendix B.

Certification compliance and RF

RF Certification/ Restrictions

restrictions for the modem and antenna.

 

 

Appendix C. Warranty

QUALCOMM warranty information for

 

the GSP-1620 modem.

 

 

Appendix D. Product Support

How to contact QUALCOMM Globalstar

 

Customer Service.

 

 

Appendix E.

Quick reference list of hardware

Specification Summary

specifications for the GSP-1620 modem

 

and antenna.

 

 

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Qualcomm GSP-1620 specifications How This Manual Is Organized, Xviii

GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.