Qualcomm GSP-1620 specifications Providing Power to the Modem, Tip

Models: GSP-1620

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Integrator’s Reference Manual

Providing Power to the Modem

The GSP-1620 modem requires input DC power of 5.6 V to 16 V, 1 Amp (maximum), with a maximum of 50 mV peak-peak ripple and noise.

Using the contents of the Modem Integrator’s Kit, you can power your bench modem in two ways:

Use the AC adapter on the Diagnostic cable

Use an optional DC power supply connected to the Interface cable bridle — this allows you to monitor exact power levels

The use of a fuse is strongly recommended in the DC power supply. A fuse with a minimum melting I2t rating of 0.02 A2 seconds will be sufficient. For complete details about DC power requirements and power supply impedances, see DC Power on page 7-15.

Tip

For a quick bench setup or service programming, consider just using the

 

provided AC adapter to power the modem.

Caution

You CANNOT have both a DC power supply and the AC adapter

connected to the modem at the same time. This may cause the modem

 

 

to fail to power up and may damage the modem.

Note

The following power-on procedure is suitable for a bench setup.

However, if you are developing modem applications, follow the

 

 

power-on process explained in Power-Onon page 7-17.

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80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications Providing Power to the Modem, Tip

GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.