Integrating GSP-1620 Modems into OEM Products

from time to time upon notice to the buyer. The product markings shall appear in a size and location reasonably agreed to by both parties.

Figure 7-3 shows the QUALCOMM marking suitable for OEM enclosures (included on the Modem Integrator’s Kit CD as an Encapsulated PostScript [EPS] file).

Figure 7-3. QUALCOMM Mark for OEM Enclosures

Integrated Product Regulatory Labeling

The GSP-1620 modem as delivered by QUALCOMM Incorporated is approved and labeled in accordance with the requirements of the FCC and the European Union (see Appendix B, RF Certification/Restrictions).

If the regulatory labeling is not visible when the modem is integrated into the final product, then the labels must be applied to the product enclosure. QUALCOMM Incorporated authorizes the duplication and use of these regulatory approvals on the integrated product provided that the modem has not been modified or altered to the extent that the electromagnetic performance has been degraded (see Modem Mounting Guidelines on page 7-19 and Appendix B, RF Certification/Restrictions).

The OEM or integrator is responsible for ensuring that the product complies with all the regulatory requirements for their target market and labeled accordingly.

The label must be located on the product in an area that can be easily viewed and the type size must be large enough to be legible without the aid of magnification. The integrator labeling may be worded as follows:

“This Product Contains a Globalstar Radio Transceiver FCC ID: J9CGSPDM1; CE 168”

80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications Integrated Product Regulatory Labeling, Qualcomm Mark for OEM Enclosures
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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