Integrator’s Reference Manual

Table E-1. Specification Summary — GSP-1620 Modem

Antenna Cable (not included)

Two cables required: transmit and receive

 

Male SMA to Male MCX

 

Transmit cable maximum 0.6 dB insertion loss

 

@ 1618 MHz

 

 

Receive cable maximum 3.0 dB insertion loss

 

@ 2492 MHz

 

 

 

 

Certification

FCC

 

 

CE

 

 

 

 

Modem Environmental Conditions

Operating:

-30 °C to +60 °C

 

Storage:

-40 °C to +85 °C

 

Relative Humidity: 5% to 95% (under 40 °C)

 

The data modem is sensitive to very high ambient

 

noise levels. Steps must be taken to ensure that the

 

noise level at the modem does not exceed 110 dB OSPL

 

(Overall Sound Pressure Level).

 

Shock mounts must be used when the environment

 

includes excessive vibration. The GSP-1620 modem

 

will meet or exceed all operational vibration

 

requirements defined in Table 7-5 when E-A-R

 

damping feet (MF-100-UC04-H, black) are used as

 

shock mounts.

 

 

 

 

Antenna Environmental Conditions

Operating/Storage:

-40 °C to +85 °C

 

Relative Humidity:

5% to 100% (under 40 °C)

 

Signal fading associated with trees, buildings, and

 

other obstacles that prevent a clear line-of-sight to the

 

satellite can cause degraded operation.

 

Any ice or freezing rain on the radome of the Outdoor

 

Unit (ODU) will cause degraded performance. Steps

 

must be taken to ensure that ice formation is kept to a

 

minimum on the ODU.

 

 

Supporting Products

GSP-1620 Modem Integrator’s Kit (MIK)

 

Globalstar User Terminal Program Support Tool

 

(UTPST) (modem provisioning tool)

 

 

 

E-2

80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications Fcc
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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