Getting Started

The GSP-1620 modem is a bare board “sandwich” stack of

Circuit Card Assemblies (CCA) containing two boards:

•Globalstar RF board — includes the LNA, RF power amp, upconverters and downconverters, TCXO, synthesizers, and the remaining power electronics.

•Globalstar Digital board — includes the processor, the modem, and some of the power management electronics.

QUALCOMM offers the GSP-1620 modem without a mechanical enclosure, anticipating that OEMs will integrate and package the modem with the end-user’s application.

The GSP-1620 modem operates in the “Globalstar (or satellite) data mode only,” as opposed to the GSP-1600 Tri-Mode Phone, which has additional terrestrial cellular (analog and digital) and voice capabilities. The GSP-1620 modem is powered by an external power source provided by the user.

A weatherproof Dielectric Resonator Antenna (DRA), sometimes referred to as an Outdoor Unit (ODU), comes with each modem. OEMs provide antenna cables (SMA to MCX connectors), to meet customer antenna-cable length needs.

A single DB-25 (male) connector is used for the user interface port. The DB-25 carries DC power, as well as the Data and Control RS-232 signals, between the SCADA application (DTE) and the modem (DCE).

A Diagnostic port on the modem allows network provisioning (service programming) and software upgrades.

What’s in the Modem Integrator’s Kit?

Your GSP-1620 Modem Integrator’s Kit (MIK) is designed to help you rapidly develop user applications for GSP-1620 modems.

Table 1-2 shows the items contained in your GSP-1620 Modem Integrator’s Kit (QUALCOMM part number: MCN 65-82317-1).

80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications What’s in the Modem Integrator’s Kit?
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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