Integrator’s Reference Manual

 

For hole size and locations, connector locations, and overall

 

envelope dimensions, see Figure 7-1 on page 7-4 and Figure

 

7-2 on page 7-5.

Caution

When you mount the GSP-1620 modem into an enclosure or onto a

 

surface, you must exercise care during the process. Adhere to the

 

following recommendations:

 

• Observe handling precautions necessary to avoid damage

 

by ESD.

 

• Fasten the modem to a planar surface of sufficient

 

flatness and rigidity to prevent flexing of the modem.

 

• Use shock mounts when the environment includes

 

vibration in excess of that shown in Figure 7-9 on page

 

7-33.

 

• Use acoustic dampening material when the environment

 

includes acoustic noise in excess of 110 dB OSPL (Overall

 

Sound Pressure Level).

 

• Do not use fasteners that will damage the grounding

 

areas around the through holes.

 

• Do not fasten the modem using tools with speed and/or

 

torque that will cause damage to the printed circuit

 

board.

 

• Do not fasten the modem with enough clamping force to

 

damage the printed circuit board.

 

• Exercise caution and do not damage components on the

 

modem during handling.

Note

The GSP-1620 modem meets or exceeds all operational vibration

 

requirements defined in Table 7-5 when E-A-R damping feet

 

(MF-100-UC04-H, black) are used as shock mounts.

QUALCOMM Mark on OEM Enclosures

Each GSP-1620 based product and its packaging shall bear the “CDMA by QUALCOMM” mark and such other mark(s) of QUALCOMM, or those which QUALCOMM has the right to use and permit the use of, as QUALCOMM may designate

7-20

80-99208-1 Rev. D

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Qualcomm GSP-1620 specifications Qualcomm Mark on OEM Enclosures
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GSP-1620 specifications

Qualcomm GSP-1620 is a powerful, cutting-edge SoC (System on Chip) that is tailored for the demands of modern mobile and embedded applications. Designed to deliver high performance, energy efficiency, and advanced connectivity, the GSP-1620 stands out in the competitive landscape of processor solutions.

One of the main features of the GSP-1620 is its multi-core architecture, which facilitates simultaneous processing of multiple tasks. This architecture ensures enhanced multitasking capabilities, allowing devices to run complex applications smoothly without compromising performance. The GSP-1620 integrates Qualcomm's latest Kryo CPU technology, which optimizes performance while maintaining lower power consumption.

The GSP-1620 excels in graphics performance, powered by Adreno GPU technology. This integration enables rich visual experiences, making it ideal for gaming, augmented reality, and immersive multimedia applications. The GPU's capabilities allow for high frame rates and stunning graphics, ensuring that users enjoy a premium visual experience.

In terms of connectivity, the GSP-1620 supports advanced wireless technologies, including 5G, Wi-Fi 6, and Bluetooth 5. With these capabilities, users can expect ultra-fast data speeds, low latency, and improved networking performance. The integration of Qualcomm’s Snapdragon X55 modem enhances the SoC's capability to deliver seamless connectivity in various environments, whether indoors or outdoors.

Moreover, the GSP-1620 features cutting-edge AI and machine learning capabilities, enabled by Qualcomm’s Hexagon DSP technology. This allows for efficient processing of AI tasks, supporting functionalities such as voice recognition, image processing, and real-time translation. It makes the GSP-1620 suitable for applications in smart devices, automotive solutions, and industrial IoT.

Security is a priority in the design of the GSP-1620. The SoC incorporates hardware-based security features that protect sensitive data and applications, ensuring robust defense against cyber threats. This is vital for applications requiring high levels of security, such as mobile payments and confidential communications.

Lastly, the GSP-1620 is designed with scalability in mind. Its modular architecture allows manufacturers to customize the chipset according to specific needs, making it a versatile solution for a broad range of devices, from smartphones and tablets to wearables and embedded systems.

In summary, Qualcomm GSP-1620 combines high-performance processing, advanced graphics capabilities, sophisticated connectivity options, AI support, and robust security features. With these characteristics, it sets a new standard for mobile and embedded platforms, driving innovation in a variety of industries.
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